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Monday 19 January 2026
Advantest ATE lead times remain tight as AI and memory markets expand
As demand strengthens in markets such as GPUs and high-bandwidth memory (HBM), Japan-based Advantest said orders for semiconductor automated test equipment (ATE) remain stable, with...
Monday 19 January 2026
Oppo's reintegration of Realme signals push for cost discipline and sharper brand segmentation
Realme, once an independent smartphone brand, will be reintegrated as a sub-brand under Oppo in a strategic move to enhance competitive positioning. This realignment will see Oppo...
Monday 19 January 2026
Taiwan's DDI chipmakers fight for survival beyond displays

Taiwanese DDI vendors rode a post-pandemic growth wave, but demand turned increasingly uncertain in 2025. Weak consumer end markets, slowing...

Sunday 18 January 2026
South Korea signs IP pact again, China-linked tech leaks still dominate
South Korea's Intellectual Property Office (KIPO) signed a new Memorandum of Understanding (MOU) on intellectual property cooperation with China's National Intellectual Property Administration...
Sunday 18 January 2026
SK Hynix accelerates advanced packaging from Korea to Indiana
SK Hynix plans to invest KRW19 trillion, about US$12.9 billion, to build an advanced semiconductor packaging plant in Cheongju, South Korea, as it moves to secure capacity for AI-driven...
Saturday 17 January 2026
NAND makers hike prices up to 100%, squeezing low-end consumer drives
The large-scale deployment of artificial intelligence servers has driven a sharp increase in demand for mass storage, with market sources saying NAND flash contract prices for the...
Saturday 17 January 2026
Samsung DS rebounds to record KRW20 trillion under new leadership
Samsung Electronics Vice Chairman Jun Young-hyun, since his appointment in May 2024, has spearheaded significant changes at the company's Device Solutions (DS) division, reversing...
Saturday 17 January 2026
TSMC sees memory price hikes unlikely to curb demand as Apple and Samsung adapt
Tight memory supply has driven market prices sharply higher, prompting industry expectations that 2026 PC and smartphone end-demand will face downward pressure. However, TSMC stated...
Friday 16 January 2026
Biwin Storage profit jumps 427% as memory cycle turns
China's domestic memory module maker Biwin Storage Technology has released the A-share market's first major 2025 profit outlook, signalling a sharp earnings rebound as memory prices...
Friday 16 January 2026
Xiaomi reportedly skips 2nm for Xring O2, chooses TSMC 3nm to cut costs

Xiaomi's second-generation in-house mobile processor, the Xring O2, will skip TSMC's 2nm process and instead use the company's 3nm N3P...

Friday 16 January 2026
Taiwanese power semiconductor firms report mixed 2025 results amid supply chain shifts
Taiwanese power semiconductor companies, including Taiwan Semiconductor Company (TSC), Panjit International, and Eris Tech, have recently disclosed their 2025 revenue results, anticipating...
Friday 16 January 2026
Formosa Chemicals plans to exit petrochemical red ocean and enter high-end electronics
The petrochemical industry has been stuck in an intensely competitive red ocean market. The Chinese government has begun promoting measures to curb excessive internal competition,...
Friday 16 January 2026
Challenges mount for China's solar industry as tax rebates end
China is phasing out export tax rebates for the solar industry, marking an end to a crucial lifeline that has propped up the industry for more than a decade.
Friday 16 January 2026
Commentary: Taiwan-US form high-tech strategic partnership to counter China's rise
The long-discussed Taiwan-US tariff negotiations have finally concluded, agreeing on US$500 billion investment and reciprocal tariffs aligned with those of the EU, Japan, and South...
Friday 16 January 2026
Commentary: TSMC's unstoppable momentum faces one wild card
Record profits. Soaring margins. Relentless demand. TSMC's January 15, 2026, earnings call painted a picture of semiconductor dominance so complete it seems almost untouchable. Alm...