As GenAI accelerates, e-commerce is shifting from traditional traffic management toward AI-assisted shopping and intelligent operations. Software-as-a-service (SaaS) e-commerce platform...

China's largest chip equipment makers are buying their way into hybrid bonding, the advanced packaging step that global players from Besi to ASML are also chasing. For Chinese firms,...

As interest rates fluctuate, bond yields rise, and Chinese AI models intensify competition, market attention is shifting from technological development and infrastructure expansion...

TSEC is focusing its overseas expansion on Japan's rooftop solar market and expects Taiwan's solar installations to recover in 2027 from a market low point. For the Taiwan-based solar...

Taiwan Semiconductor Manufacturing (TSMC) is seeing rising demand for CPUs related to agentic artificial intelligence (AI), but has not yet included CPUs in its calculations of AI...

As artificial intelligence increasingly blurs the boundary between the digital and physical worlds, complications associated with real-world deployment — particularly the extreme...

Chinese semiconductor technology start-up Langdao Silex (Shanghai) Technology has publicly unveiled an extreme ultraviolet (EUV) light source prototype with a claimed 90% localization...

As Manus, one of China's more distinctive AI startups, became entangled in the high-profile unwinding of its acquisition by Meta, the startup's failed attempt to capture opportunities...

China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F² DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond...

South Korea's LG Innotek expects its semiconductor substrate business to improve in 2027 as it pursues long-term supply agreements (LTAs) with major technology companies and prepares...

LINE Taiwan marked its 15th year in the market with a strategy shift that signals broader ambitions beyond messaging. The company is expanding into AI-powered daily services, aiming...

Qualcomm has historically provided standard chips primarily through its Snapdragon product line, serving a broad range of end customers. After officially launching its Dragonfly data...

FIC Group opened its PRO3C (Malaysia) Sdn. Bhd. manufacturing facility in Johor, Malaysia, on October 15, expanding its optical communications production footprint in Southeast Asia...

SK Hynix is seeking US approval to ship additional American chipmaking equipment to its NAND flash facility in Dalian, China, linking the request to a potential investment in a new...

Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (≈ US$1.94 billion) in...