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Wednesday 24 June 2026
China's autonomous driving crackdown targets overpromised smart vehicle tech
China has announced its first mandatory national safety standard for Level 3 (L3) and Level 4 (L4) autonomous driving, with implementation set for July 2027.
Wednesday 24 June 2026
China's chip-equipment push starts to weigh on Japanese suppliers

China's push to build a domestic semiconductor equipment industry is beginning to cut into revenue at major Japanese toolmakers, with...

Wednesday 24 June 2026
VFT targets semiconductors, foldable display, energy materials

Optical film and nano-coating materials developer Victory For Technology (VFT) is focusing on three key areas — AI and semiconductor...

Wednesday 24 June 2026
AI robot paths split as humanoid prices plunge, industrial orders hit record

China's Unitree Robotics has slashed its humanoid robot prices sharply, in stark contrast to the industrial robot market, where prices...

Wednesday 24 June 2026
Syncomm accelerates AIoT push on wireless audio strength
Syncomm Technology has built solid momentum in wireless audio transmission chips and modules and is now accelerating its shift into AIoT applications across energy monitoring, elder...
Wednesday 24 June 2026
China CMP tool leader Hwatsing seeks US$550M to close chip equipment gap
Hwatsing Technology, China's leading domestic supplier of chemical mechanical planarization (CMP) equipment, is seeking up to CNY4 billion (approx. US$552 million) through a private...
Wednesday 24 June 2026
Gem Terminal bets on specialty copper to capture AI server cooling demand

Gem Terminal Industrial Co. said its strategic transformation into specialty copper materials drove record quarterly profits in the...

Wednesday 24 June 2026
EU eyes tariffs on Chinese PHEVs as BEV curbs prove ineffective
The EU has imposed higher tariffs on Chinese battery electric vehicles (BEV) for more than a year, but the impacts have been limited. According to foreign media reports, the EU is...
Wednesday 24 June 2026
JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...
Tuesday 23 June 2026
China's Starlink challenger Qianfan seeks US$740M backers for LEO satellite expansion

Shanghai Spacecom Satellite Technology (SSST, also known as Ambandha), operator of China's Qianfan low Earth orbit (LEO) satellite...

Tuesday 23 June 2026
AI data center buildout fuels optical interconnect race, but 6-inch InP wafers hit supply wall

Technology giants are continuing to expand AI computing infrastructure, driving demand for high-performance optical interconnect components...

Tuesday 23 June 2026
Nippon Sanso raises helium prices over 30% on Middle East instability-driven supply crunch

Industrial gas manufacturer Nippon Sanso Holdings announced it will raise prices for all helium products in the Japanese market starting...

Tuesday 23 June 2026
Huawei renews Wi-Fi 6 patent push, putting networking equipment makers on alert

Huawei has continued to pursue patent litigation against networking equipment makers in Europe in recent years, with its latest case...

Tuesday 23 June 2026
WeMo bets on asset-light, open-platform model to scale Taiwan's MaaS ecosystem and drive growth for the next decade
Approaching its 10th anniversary, Taiwan-based shared mobility company WeMo Scooter is doubling down on an open-platform strategy to cement its position in the Mobility-as-a-Service...
Tuesday 23 June 2026
Kaori's Kaohsiung plant targets 2027 output for AI cooling and green energy demand
Kaori Heat Treatment held a groundbreaking ceremony for its new plant at Kaohsiung's Ciaotou Science Park on June 23. Chairman Dr. Allen Wu led the management team at the event, joined...