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Tuesday 1 September 2026
TSMC delays CoWoS orders as CoPoS plans take shape
TSMC's reported delay in placing 2027 advanced packaging equipment orders has sparked market speculation that the company sees excess CoWoS capacity ahead. But equipment suppliers...
Tuesday 1 September 2026
Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race
China's leading DRAM maker CXMT has gone from years of accumulated losses to one of the most profitable companies on the mainland market, propelled by an extraordinary memory upcycle...
Tuesday 1 September 2026
JCET lifts 2026 capex to CNY10 billion as AI packaging demand outruns forecasts
JCET Group is sharply increasing spending as demand for artificial intelligence strains advanced packaging capacity worldwide. The Chinese chip tester and assembler said the shift...
Tuesday 1 September 2026
Huawei's revenue climbs 9.6%, but AI, chips and HarmonyOS exact heavier R&D toll
Huawei Technologies increased first-half revenue in 2026 while profit fell sharply, highlighting the growing cost of its effort to build a self-sufficient technology stack spanning...
Tuesday 1 September 2026
Commentary: CXMT's HBM3E leap gives China's AI chipmakers a new path to scale
China's leading DRAM maker CXMT has reportedly begun small-volume production of HBM3E, a step that could ease one of the most important hardware constraints on China's domestic AI...
Tuesday 1 September 2026
China's humanoid robot cost cuts run into three bottlenecks
Humanoid robot scaling is still constrained by price, and Chinese humanoid robots — which command the largest global market share — show a sharp gap between consumer and...
Tuesday 1 September 2026
China reportedly moves space computing from concept towards commercial deployment
China's push to build computing infrastructure in orbit is moving beyond experimental projects, with several initiatives this year pointing towards a more coordinated effort to develop...
Tuesday 1 September 2026
Semicon Taiwan 2026 to spotlight AI-driven semiconductor supply chain shifts
Semicon Taiwan 2026 is set to open soon as Semiconductor Equipment and Materials International said AI is pushing a new wave of technology upgrades across the global chip industry...
Tuesday 1 September 2026
China's Xenomi LLM brings quantum computing into AI agent decision-making
China is testing a new route for combining quantum computing with generative AI, moving beyond model training toward the decision layer used by AI agents. Beijing Guoguang Liangchao...
Tuesday 1 September 2026
Buima returns to profit in the second quarter on battery module demand
Buima swung back to profitability in the second quarter of 2026 as a recovery in its battery module shipments and gains from asset disposal lifted results. The company said demand...
Tuesday 1 September 2026
Commentary: Why America fell behind on Open models — and how Nvidia plans to close the gap
When DeepSeek burst onto the scene in early 2025, it wiped nearly US$600 billion from Nvidia's market value in a single day. By the summer of 2026, Moonshot AI's Kimi K3 had triggered...
Tuesday 1 September 2026
AI server cooling specialist Nidec expands Vietnam capacity, forms liquid-cooling team
Nidec Chaun-Choung Technology plans to establish a dedicated liquid-cooling team and deepen cooperation with major cloud service providers, citing rising thermal-management demand...
Tuesday 1 September 2026
Humanoid robots gain a sense of touch, lifting tactile sensor adoption above 60%
If vision serves as a robot's eyes, tactile sensors function as its skin and peripheral nerves. In China, leading dexterous-hand makers have increasingly begun treating tactile sensing...
Tuesday 1 September 2026
Acme sees years of SiC growth as data center demand builds
Capex by the world's nine largest cloud service providers (CSPs) is expected to rise about 90% year over year in 2026, while AI servers are growing faster than conventional servers,...
Tuesday 1 September 2026
Samsung is said to develop 8-layer HBM4E for Nvidia's NVHBM push
Samsung Electronics is reportedly developing an 8-layer version of seventh-generation high-bandwidth memory for Nvidia, matching the chipmaker's requirements for its customized NVHBM...