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IC backend service firms to ramp up bumping, WL-CSP capacities in 2014, say sources

Mavis Hong, Taipei; Steve Shen, DIGITIMES Asia Tuesday 31 December 2013 0

Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend service capacities such as bumping and wafer level-chip scale package...

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