REALTIME NEWS

Trends in mobile computing technologies and component packaging

Staff writer, DIGITIMES, Taipei

Jun 6, 2014, 10:18 0

2.5D interposer packaging technologies are being used in products ranging from Intel's Haswell/Broadwell processors to AMD's mobile high-performance GPU chips. DDR4, which is about to be introduced into the mainstream, is also likely to incorporate 3D...

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