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FOPLP ideal for heterogeneous integration IC packaging, says Powertech chairman

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Wednesday 26 September 2018 0

Taiwan IC backend service provider Powertech Technology is aggressively developing fan-out panel level packaging (FOPLP) technology in line with the "heterogeneous integration" trend looming to dominate the packaging sector during the 2020-2030 period,...

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