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Chipmakers accelerate transition to 120/128-layer 3D NAND process

Siu Han, Taipei; Jessie Shen, DIGITIMES Asia Tuesday 4 June 2019 0

Chipmakers have stepped up development of their respective 120/128-layer 3D NAND flash process technologies for cost competitiveness, and are gearing up to have the technology transitions kick off in 2020, according to industry sources.

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