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Chengdu Silan raises CNY500 million to fund automotive IC packaging biz

Staff reporter, Shanghai; Jessie Shen, DIGITIMES Asia Friday 16 December 2022 0

Credit: DIGITIMES

Chengdu Silan Semiconductor Manufacturing, a subsidiary of discrete component IDM Silan Microelectronics, has raised CNY500 million (US$71.7 million) from two new Chinese investors to fund its automotive IC packaging business. Government-led Chengdu...

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