Ever since Intel launched its automotive efforts in a high-profile announcement in early 2024, with its automotive business headquartered in China, the chipmaker's ambitions for this segment have remained just as strong after current CEO Lip-bu Tan took the helm in March 2025.
At the recent Auto Shanghai 2025, Intel marked its debut at the trade show with a number of major announcements. The company launched its second-generation AI-enhanced software-defined vehicle (SDV) SoC, marking a first for the automotive industry with its multi-process node chiplet architecture, and announced partnerships with ModelBest and Black Sesame Technologies to collaborate on smart cockpits and immersive cockpit experiences.
In post-press conference interviews with Chinese and foreign media, Intel VP and Intel Automotive GM Jack Weast stressed that the automotive sector represents one of the greatest growth opportunities for Intel, and the company chose to base its automotive business in China with an eye on the massive potential presented by China's car market.
When asked about the current revenue contribution of Intel's automotive business, Weast declined to give a specific figure. However, he noted that automotive is part of Intel's Client Computing Group (CCG), alongside the company's PC-related businesses, meaning that the automotive business can leverage Intel's substantial investments in AI PCs.
In addition, Weast noted that Intel is aspiring to become an integral part of the future of the automotive industry, and the massive potential for growth was what led the company to launch its automotive efforts, as well as his own relocation to China.
Intel first announced its entry into the automotive market with the launch of its first-generation AI-enhanced SDV SoC at CES 2024. Nearly 18 months later, the company has unveiled its second-generation product, which employs a multi-node chiplet architecture that integrates independent CPU and GPU computing units while utilizing multiple process nodes, according to Weast.
This allows a flexible mix of process nodes to achieve optimal performance: for example, I/O modules do not require the most advanced process nodes, and thus more mature process technologies can be used to optimize performance.
Compared to the first-generation SDV SoC, the second-generation product features a tenfold increase in AI performance, a 61% boost in CPU power efficiency per watt, and improved audio and graphics processing capabilities with support for up to 12 camera channels. The new SoC is slated to be installed in mass-production vehicles beginning in 2026.
According to Weast, the new SoC will bring the AI PC experience to vehicles, allowing users to enjoy AAA games, hi-def video, and audio right inside the car. Furthermore, he hinted at further partnership announcements to come in 2025, following the footsteps of Chinese AI chipmaker Black Sesame Technologies and AI model firm ModelBest.
In terms of immersive cockpits, Weast noted that Intel is open to collaborating with all advanced driver assistance system (ADAS) providers in addition to Black Sesame. Intel's partnership with ModelBest will primarily center on on-device, AI-enhanced smart cockpits to define the next generation of automotive AI.
Article edited by Jack Wu
