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Thursday 22 May 2025
Xiaomi vaults to 3nm with XRing O1, pairing custom AP with external baseband
Xiaomi's XRing O1 will debut in the 15S Pro smartphone and Pad 7 Ultra, reportedly built on TSMC's second-gen 3nm (N3E) process. With around 19 billion transistors, the chip ranks...
Thursday 22 May 2025
Xiaomi cracks the 3nm barrier with XRing O1: Qualcomm faces a new reality
On the evening of May 22, Xiaomi is expected to launch its self-developed 3nm mobile system-on-chip (SoC), the XRing O1, in a move that underscores both the company's technological...
Thursday 22 May 2025
Xiaomi pushes the edge with 3nm XRing O1 chip, threading US regulatory needle
Xiaomi is set to unveil its latest slate of strategic products at 7 pm CST on May 22, headlined by the long-awaited debut of its in-house smartphone SoC, the XRing O1—a bold...
Tuesday 20 May 2025
Retronix launches 2 AI edge platforms: Sparrow Hawk SBC and Raptor SoM, powered by Renesas R-Car V4H SoC
Retronix Technologies Inc. announced the launch of two cutting-edge AI edge computing platforms, developed in collaboration with Renesas Electronics Corporation.
Tuesday 20 May 2025
Xiaomi pledges CNY50 billion investment in chip design over next decade
Xiaomi founder and CEO Jun Lei announced on May 19 via Weibo that the company will unveil its first 3nm mobile system-on-chip (SoC), the "Xring O1," on May 22. He also revealed that...
Tuesday 20 May 2025
Xiaomi's XRing SoC: next HiSilicon breakthrough or Zeku-style flameout?
Years after launching the Pinecone Surge S1 in 2017, Xiaomi founder and CEO Lei Jun announced the company's return to in-house smartphone chip design. Its new self-developed SoC,...
Friday 16 May 2025
Xiaomi to launch first self-developed smartphone SoC in late May
On May 15, Xiaomi founder Lei Jun announced via social media that the company will officially launch its first self-developed smartphone system-on-chip (SoC), the Xring O1, by the...
Friday 9 May 2025
Chiplets technology gains ground as global semiconductor giants invest in modular chip future
TSMC, Intel, Samsung Electronics, and Advanced Micro Devices (AMD) are backing the modular semiconductor approach that breaks down system-on-chip (SoC) designs into smaller functional...
Wednesday 7 May 2025
As Qualcomm stalls in China, MediaTek powers up
Recently, the two major Android SoC brands, MediaTek and Qualcomm, have shared their market outlooks. Both companies maintain a positive view of their non-smartphone business performance...
Wednesday 7 May 2025
Xiaomi reportedly separates Xring chip division in move to preempt US action
Xiaomi is reportedly planning to debut its first in-house smartphone System on Chip (SoC) by late May, with sources indicating the company will restructure its chip division to reduce...
Monday 5 May 2025
Intel focuses automotive efforts on China with Auto Shanghai debut
Ever since Intel launched its automotive efforts in a high-profile announcement in early 2024, with its automotive business headquartered in China, the chipmaker's ambitions for this...
Tuesday 29 April 2025
Xiaomi's 'Xring' chip reportedly set for late May release, taking aim at Snapdragon's crown
Xiaomi is expected to launch its in-house smartphone SoC in 2025, with the latest reports pointing to a potential debut in late May. According to Wccftech, the Chinese tech...
Wednesday 16 April 2025
Xiaomi's first in-house SoC set to launch, led by ex-Qualcomm veteran
Xiaomi is restructuring its mobile division ahead of the launch of its first in-house smartphone SoC, branded "Xuanjie." According to ICsmart and Guancha, the company...
Thursday 27 March 2025
Inergy sees growth in 2Q25 as AI server cooling fans ramp up
The chairman of IC design house Inergy, John Lin, stated that the growth momentum in the server and energy storage sectors is promising. The company has successfully entered the supply...
Wednesday 26 March 2025
India's Netrasemi to launch AI-optimized SoCs for edge computing, eyes global market
Indian semiconductor startup Netrasemi is set to launch its first AI-optimized system-on-chips (SoCs) for edge computing applications, with tape-outs scheduled at TSMC in April and...