Following MediaTek's launch of the Dimensity 9400 platform, Vivo and Oppo are set to roll out their X200 and Find X8 models, respectively, this week. In response to Qualcomm's upcoming...
Huawei is set to launch its latest flagship smartphone powered by the rumored Kirin 9100, a commercially uncompetitive chip without government support.
MediaTek's flagship platform, Dimensity 9400, and Qualcomm's Snapdragon 8 Gen4 are set to officially launch in October. With both products making the official transition to the 3nm...
Android smartphone manufacturers are getting ready to launch their new flagship AI-enhanced models, with competition among key SoC suppliers expected to intensify, according to industry...
MediaTek has kicked off a promotional campaign for its new Dimensity 9400 mobile SoC, which will be officially unveiled on October 9, followed a week later by the launch of the Vivo...
With the launch of Apple's iPhone 16 in major global markets, various media outlets have begun releasing their reviews. Opinions on the new Camera Control button and the upgraded...
Apple's recently unveiled A18 and A18 Pro processors, introduced alongside the iPhone 16 series, have generated less excitement than their predecessors. Even Apple provided relatively...
Huawei's recent Mate XT tri-fold smartphone launch has sparked curiosity about China's advancements in chip manufacturing. The company's reluctance to disclose chip details has left...
iCatch Technology, a leading AI image processing IC design company, is excited to announce its participation in the SEMICON Taiwan 2024 Exhibition, taking place from September 4-6,...
US-based xMEMS Labs is set to deliver its newly unveiled XMC-2400 µCooling™, a single-chip (SoC) air-cooled all-silicon active cooling solution utilizing MEMS technology,...
US-based xMEMS Labs has developed the XMC-2400 µCooling™, a single-chip (SoC) air-cooled all-silicon active cooling solution utilizing semiconductor micro-electro-mechanical...
