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SK Hynix debuts 16-layer HBM4, set to power AI chips in 2026

Jessica Tsai, Taipei; Charlene Chen, DIGITIMES Asia 0

At HPE Discover 2025, SK Hynix unveiled its 16-layer sixth-generation high bandwidth memory (HBM4) for the first time, aiming to maintain its technological leadership in the HBM4 field and drawing widespread attention.

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