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LG accelerates hybrid bonding development to challenge Hanmi and Hanwha

Lillian Chen, Taipei; Emily Kuo, DIGITIMES Asia 0

Credit: LG Electronics

LG Electronics is accelerating its deployment in the HBM equipment business after reportedly investing in hybrid bonding development. With Hanmi Semiconductor dominating the market and Hanwha Semitech entering the space, LG's involvement will potentially...

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