SEMICON West 2025, one of the major semiconductor exhibitions, is being held in Phoenix, Arizona. Topco Scientific is participating alongside fourteen partners from Japan and Taiwan, focusing on semiconductor process materials, equipment, automation systems, and precision components; demonstrating its competitive edge in global supply chain platform integration services.
Dainichi Shoji is showcasing 12-inch PES Cassettes; Shin-Etsu Polymer is presenting FOUP and FOSB wafer transport solutions; and specialty chemical maker Daxin Materials is demonstrating high-purity thinning agents and laser release layer coating technologies. Chemleader Corporation (CLC) and Tri Chemical are also offering a variety of specialty chemicals.
ChenFull International is displaying factory-use components such as dampers, tees, and elbows. Taiwan E&M Systems is presenting components for etching and thin-film processing, showcasing a comprehensive and diverse supply chain for materials and parts.
In collaboration with leading equipment manufacturers, including Grand Process Technology (GPTC), Bossmen, ACEMACH, Japan's Mimasu Semiconductor, Hatsuta, and First EXA, Topco provides sales, installation, and maintenance services across the US. These services cover wet etching equipment, precision nano-level photomask storage cabinets, photomask inspection machines, single-wafer etching tools, automated fire suppression systems, and quartz tube cleaning tools; all ensuring plant safety and process reliability.
As semiconductor processes advance into ever-smaller nanometer scales, photomask dimensions continue to shrink. To avoid defects being printed onto wafers and affecting yield, photomask inspection tools must become more precise. ACEMACH's photomask inspection equipment ensures stable wafer yield and has successfully entered first-tier fabs.
Additionally, Topco is working with the Mirle Group to develop smart automation machines that integrate handling, line scheduling, and inspection modules. These solutions provide fabs with overhead hoist transport (OHT) and photomask storage solutions, comprehensively enhancing production efficiency and yield while reducing wafer contamination and damage risks.
Topco established its US subsidiary in 2021 and has already set up locations in Arizona and Texas, offering local warehousing, equipment installation, technical support, and maintenance services. A third operations site is planned for Boise in 2026 to align with the construction plans of a major US-based memory chipmaker.
Topco managing director, Charles Lee, stated that Arizona has become a hub for advanced node wafer manufacturing, while North Texas has developed a comprehensive and highly integrated semiconductor supply chain and ecosystem. By establishing local bases and dispatching engineers to Idaho for on-site equipment installation and parts replacement, Topco aims to meet customer needs efficiently and responsively.
Article edited by Jack Wu
