AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at the centre of this week's tech agenda.
TSMC extends its lead while Samsung and Intel chase capacity
Samsung Electronics posted more than US$58.4 billion in second-quarter 2026 operating profit, yet its shares fell as AI sentiment cooled. DIGITIMES Intelligence analyst Luke Lin expects TSMC's CoPoS mass production in the second half of 2029, glass core substrates only after 2030, and TSMC's 3nm/2nm capacity to exceed Samsung's and Intel's by seven to nine times in 2028. He sees Intel 14A volume production for external customers slipping beyond 2030, while Samsung's HBM4 base-die demand has filled its 4nm lines and could support 15%-20% price increases in the second half of 2026.
Hanmi targets ASE's CoWoS expansion
Hanmi Semiconductor's 2.5D TC Bonder 40, built for TSMC's CoWoS process, is expected to reach ASE as Hanmi expands beyond HBM equipment and establishes Hanmi US by the end of 2026. ASE has raised 2026 capex from US$7 billion to US$8.5 billion and is building 15 plants and acquiring facilities. Yole Group expects advanced packaging revenue to rise from US$46 billion in 2024 to US$79.4 billion by 2030.
BTL advances HVDC AI server testing
BTL Group completed certification of a VR200 AI server power rack using HVDC 800V/1MW specifications and began rack-level testing, with bookings extending through the end of 2026. AI testing generated 13% of June revenue, which rose 17.9% to a record NT$98 million (approx. US$3.05 million); first-half revenue increased 12.1% to NT$489 million.
France-Taiwan tech ties reach production
France-Taiwan cooperation is moving into manufacturing through Foxconn's Tessalia packaging plant with Thales and Radiall, its AI infrastructure work with Bull, SiPearl's TSMC-made CPU for Europe's JUPITER supercomputer, and a CEA-PSMC research partnership. Franck Paris said France wants more Taiwanese semiconductor, server and data centre investment while linking firms such as Mistral AI with Taiwan's hardware ecosystem.
Huawei readies Kirin 2026
Huawei's four-model Mate 90 series has entered packaging and testing for a September 2026 launch. Its Kirin 2026 processor is claimed to deliver 53.5% higher transistor density and 13% faster CPU performance through Tau Scaling, while the Mate XT 2 tri-fold may debut alongside it.
SK Hynix raises US$26.5 billion, but HBM relief waits
SK Hynix's US$26.5 billion Nasdaq offering surpassed Alibaba's US$25 billion 2014 listing. The proceeds will support the KRW19 trillion P&T7 packaging plant, KRW20 trillion M15X DRAM fab, Yongin cluster, and KRW11.95 trillion in ASML EUV tools, though major new HBM capacity is unlikely before 2028.
TSMC bottlenecks lift the wider supply chain
TSMC's tight advanced-node and CoWoS capacity is redirecting work to Vanguard, UMC, Samsung, Intel, Amkor, ASE, SPIL, Xintec, VisEra, and Powertech. Vanguard's NXP joint venture is due to begin mass production in the first quarter of 2027, while TSMC and Amkor have signed another 10-year agreement. Samsung and Intel are gaining orders, but still trail TSMC in technology, yields and integrated service, leaving AI supply constraints likely through the second half of 2026.
Article edited by Jack Wu