I describe the close integration of Taiwan's semiconductor and electronics industries as the spillover of chip economic value. In earlier phases of the industry, economic value creation in electronic systems was highly concentrated at the chip level. Advancing process nodes alone was sufficient to capture most of the value. That model no longer holds. Today, improvements in manufacturing technology must propagate beyond wafer fabrication to packaging, testing, and ultimately system-level integration to translate into tradable economic value
Taiwan's information and communications technology (ICT) sector—dominated by the semiconductor industry and Electronics Manufacturing Services (EMS)—accounted for 65.2% of Taiwan's exports in 2024. This share is projected to rise to roughly 74% in 2025, reflecting the island's unique position in global industrial competition and underscoring profound implications for the country's future industrial trajectory
On January 12, 2026, Japan's scientific drilling vessel Chikyu slowly departed port, heading toward the waters near Minamitorishima Island, about 1,900km southeast of Honshu. This mission is not merely a scientific expedition but a critical test tied to Japan's national economic security and the restructuring of global critical mineral supply chains
In August 2024, the US National Institute of Standards and Technology (NIST) finalized three Post-Quantum Cryptography (PQC) standards, known as FIPS 203, 204, and 205. These standards incorporate ML-KEM algorithms for key exchange and encryption, along with ML-DSA and SLH-DSA algorithms for digital signatures. Industry leaders are actively integrating these algorithms into web browsers, operating systems, and hardware products to prepare defenses against anticipated quantum-computer-enabled cyberattacks
The development of quantum computing is increasingly taking on the character of a global arms race. Nations and corporations that secure an early lead stand to gain outsized strategic advantages. Quantum computers promise breakthroughs in drug discovery, advanced materials and industrial design. They could accelerate the training and optimization of artificial intelligence models and dramatically enhance military capabilities
If today's AI data centers are blazing "powder kegs" of heat, IBM was the visionary that prepared the "fire extinguisher" half a century ago. While Nvidia's top chips now require water cooling to operate, few realize that this technology's "biological father" actually dates back to IBM in the 1960s. Today, we explore this groundbreaking US patent 3,524,497 ("Patent 497") and its blue-cooling revolution spanning over 50 years
At the opening of his keynote, Nvidia CEO Jensen Huang delivered a stark message: the world's US$10 trillion computing infrastructure is entering a fundamental modernization phase, driven by two platform shifts unfolding in parallel
The US AI sector stands at a crossroads. After years of breakneck infrastructure expansion, cracks are beginning to show in the financial foundation supporting this boom
The global economic landscape underwent three major transformations in 2025: the Great Rebalancing, the evolution of the AI supercycle, and a US industrial revival driven by national security considerations
Two-dimensional (2D) materials were once regarded as important candidates for extending semiconductor scaling. Because they are only an atom thick, they are theoretically very suitable for fabricating extremely small, ultra-low-power transistors. However, once these ideas move into advanced logic processes, challenges begin to surface. The problem lies in the fact that using 2D materials to fabricate FETs requires process control that is nearly at the single-atom level
The rapid growth of generative AI and large-scale models has significantly increased power consumption in computing chips, pushing thermal management into critical focus. High-end AI accelerators now consume power at kilowatt levels, producing concentrated heat fluxes that challenge existing cooling methods, potentially limiting performance and reliability across data center systems
The isolation of graphene in 2004 sparked widespread expectations that two-dimensional (2D) materials could fundamentally reshape electronic devices. Graphene and transition metal dichalcogenides (TMDs) have since enabled progress in niche applications and research prototypes. Yet their impact on mainstream logic devices remains limited. The long-anticipated use of 2D materials to sustain Moore's Law through transistor channel integration has yet to materialize at scale
AI is inevitably driving innovation in global server architecture. AI servers differ significantly from traditional servers in design philosophy and operational mode. This reflects not only innovations in computing architecture but also emerging challenges in energy consumption and thermal management driven by rapidly increasing computational demands
The UN has designated 2025 as the International Year of Quantum Science and Technology, recognizing significant breakthroughs in quantum hardware, quantum error correction, and practical quantum applications throughout the year. Research firm QURECA reports that worldwide investment in quantum technologies has exceeded US$55.7 billion, reflecting growing global interest
