Samsung Electronics is stepping up talent recruitment in China to advance next-generation semiconductor development. With China's rapidly growing semiconductor IP market, Samsung is actively forging strategic partnerships with local firms to strengthen its foothold and accelerate innovation in the region
Japanese semiconductor testing equipment firm Advantest has announced its latest testing solutions for advanced applications such as high-end memory, 5G, AI, and high-performance computing (HPC). The company is also closely monitoring Rapidus's progress in mass-producing 2nm chips
Amid growing US-China tensions, display maker EDT is preparing to diversify its manufacturing footprint beyond Taiwan, joining a wider industry shift that could reshape Asia's tech supply chains. As global manufacturers seek to diversify their supply chains beyond China while maintaining their Taiwan operations, many are adopting what's known as the Taiwan +1 strategy - keeping core operations in Taiwan while expanding to an additional production base in Southeast Asia. EDT sees significant opportunities in this Taiwan +1 strategy, with plans for production line investments in Southeast Asia set for 2025
Japan is advancing its ambitious space solar power program through foundational experiments designed to collect solar energy in space and transmit electricity back to Earth
The surging AI market has driven unprecedented demand for high-bandwidth memory (HBM), placing significant strain on supply chains. In early August, reports surfaced that the Biden administration was planning stricter semiconductor export controls, targeting China's access to HBM—a key component for AI chips—and the equipment needed for its manufacturing
The Japanese government has accelerated plans to develop a next-generation supercomputer by the fiscal year 2030, succeeding the renowned Supercomputer Fugaku. This ambitious project, seeking to accelerate research and development, marks a significant step forward in Japan's technological landscape
According to ET News, SK Hynix is setting its sights on the semiconductor packaging market by offering packaging foundry services, a move that analysts say capitalizes on its expertise in high bandwidth memory (HBM)
Following Huawei's recent advancements, TCL, a leading Chinese home appliance brand, has revealed its dual-folding technology, signaling potential plans for a tri-fold smartphone. This move has sparked industry speculation on whether Samsung Electronics will join the competition in the tri-fold smartphone segment
In response to the US export control regulations introduced on December 2, China's Ministry of Finance issued a notice on December 5 regarding government procurement standards and implementation policies for domestic products, proposing to give local products a 20% advantage in bid evaluations
FuriosaAI, a Seoul-based AI chip startup founded in 2017, is making waves in the AI hardware market with its innovative accelerator chips aimed at hyperscale data centers and enterprises. In August 2024, the startup unveiled its advanced AI chip, "RNGD." The chip is positioned to challenge industry leaders such as Nvidia with a 100% power efficiency advantage over Nvidia's H100 GPUs and competitive performance metrics. Furthermore, it recently gained attention for its testing and sampling progress with global enterprises like LG AI Research and Aramco
In a significant push to support its burgeoning electric vehicle sector, China's charging infrastructure has surged to 12.35 million charging units, with silicon carbide (SiC) becoming a crucial component in the supply chain
Japanese telecommunications company KDDI and its subsidiaries KDDI SmartDrone and KDDI Research have successfully completed a fully unmanned automated logistics delivery experiment in collaboration with partners including Tier IV and Aisan Technology
The US will increase tariffs on Chinese polysilicon and silicon wafers starting January 2025, raising the rate from 25% to a staggering 50%. This move has left many companies that have established manufacturing facilities in the US feeling trapped
According to Nikkei, Rapidus chairman Tetsuro Higashi stressed in an interview that achieving the goal of producing 2nm chips involves overcoming three significant challenges- the technical feasibility of mass production, market and customer positioning, and funding issues, particularly regarding its heavy reliance on resources from the Japanese government
