The Ministry of Science & Technology of India has announced the launch of BharatGen, a generative AI initiative focused on developing foundational models in language, speech, and computer vision, according to a press release published by the Press Information Bureau of India
The patent infringement trial between Huawei and MediaTek is set to officially commence after China's Golden Week, no earlier than October 25, 2024. The patent at the center of the dispute primarily involves 4G/LTE technology
Huawei CFO Wanzhou Meng has resumed her position as rotating chairperson under the company's leadership system, beginning her six-month term on October 1, 2024, which will run until March 31, 2025. This marks her second term in Huawei's top leadership role, where she will oversee both the Board of Directors and the Executive Committee
Micro Electricity, an energy services provider, has announced a partnership with Vietnam's Saigon Telecommunications (Saigontel) to jointly develop a 300 MW solar power park and a green energy trading platform for industrial zones in southern Vietnam
Cultural sensitivity has not always been a strength of Taiwanese businesses, potentially straining Taiwan-Japan relations as Taiwan's semiconductor ventures expand overseas without fully considering local communities' perspectives
Foxconn reportedly plans to invest approximately US$50 million in its Outsourced Semiconductor Assembly and Test (OSAT) joint venture with HCL, as India continues to offer attractive subsidies for chipmaking facilities
South Korea's export momentum stayed robust in September on the back of continued demand for semiconductors, keeping the outlook upbeat for economic growth and offering positive signs for global commerce and the tech cycle
India-based IC design startup L&T Semiconductor Technologies revealed it's developing 15 products, which will be mass-produced in two years and will start the chipmaking business once it reaches a certain threshold in sales
SK Hynix recently spotlighted its high-bandwidth memory (HBM) technologies with great emphasis on its collaboration with Nvidia during its participation in TSMC's Open Innovation Platform (OIP) Ecosystem Forum
Fujifilm plans to strengthen its semiconductor materials capabilities with an investment of JPY 20 billion (US$ 140 million) to build facilities in Shizuoka and Oita, focusing on materials for sub-2nm chip processes, including photoresist
Pegatron is transforming from a traditional OEM manufacturing solution provider to a comprehensive manufacturing partner, expanding its Indian customer base beyond the electronics sector
Chung-Hsin Electric and Machinery Manufacturing (CHEM) is witnessing substantial growth driven by aggressive capacity expansion, having acquired multiple factories to boost production by approximately 20% annually. The company is focused on the domestic Taiwanese market and is also pursuing opportunities in Japan, the US, and Southeast Asia to enhance its global presence
Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. The robust spending is being driven by the regionalization of semiconductor fabs and the increasing demand for artificial intelligence (AI) chips used in data centers and edge devices
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other
The ASEAN market, spanning multiple countries, has become a fiercely competitive battleground for numerous automotive and new energy vehicle (NEV) brands. In this landscape, BYD has continued to stand out, which can be attributed to its successful deep integration with local businesses
