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Wednesday 18 June 2025
Apple turns to Alibaba for AI push in China, drawing US concern

Alibaba has open-sourced 32 variants of its latest Qwen 3 language models, designed specifically to run on Apple's MLX machine learning framework. The models are now publicly available on platforms like Hugging Face, widely used by AI developers around the world

Wednesday 18 June 2025
Nittobo material price hikes exclude AI server-grade glass fabric
Japanese glass fiber supplier Nitto Boseki (Nittobo) reportedly has raised prices of its composite material products by up to 20% due to increasing costs, but the price hike does not include electronic-grade glass fabric materials used in IC substrates and PCBs for AI servers
Wednesday 18 June 2025
US sanctions in the rearview? Huawei talks tough on 5G-A, AI at MWC Shanghai
Amid mounting US sanctions and continued supply chain constraints on its HiSilicon Ascend processors, Huawei took the spotlight at the MWC Shanghai 2025 Global Mobile Broadband Elite Forum to underscore its strategic pivot toward integrating 5G-Advanced (5G-A) with artificial intelligence (AI)
Wednesday 18 June 2025
Japan's MinebeaMitsumi extends Shibaura bid while Yageo awaits security clearance
Japanese electronics manufacturer MinebeaMitsumi has decided to extend its tender offer for temperature sensor producer Shibaura Electronic until July 1, postponing the initial deadline of June 19. The company confirmed that its offer price would remain steady at JPY5,500 (approx. US$37.90) per share. This move comes as rival bidder Yageo, based in Taiwan, continues to face investigation by Japan's foreign exchange regulatory authorities
Wednesday 18 June 2025
Huawei’s AI weather model among top performers in China tests
China’s weather agency is testing more than a dozen artificial intelligence models in an effort to enhance its forecasting, with a system from Huawei Technologies Co. showing accelerated improvement.
The best models from the trial will be prioritized for deployment by provincial bureaus, and granted priority access to official weather data, according to the China Meteorological Administration, which is running the program. The CMA has said it wants to ensure “orderly and standardized development” as the technology rapidly develops at home and abroad
Wednesday 18 June 2025
Japan's Yaskawa invests US$180M in US robot production
Japanese industrial automation giant Yaskawa has announced a US$180 million investment to establish a new production base in Wisconsin, creating the company's first industrial robot factory on American soil. This move is a response to US domestic semiconductor manufacturing policies and addresses the strong demand for automation across automotive, food, agriculture, and medical sectors, while also diversifying geopolitical risks and strengthening local supply capabilities
Wednesday 18 June 2025
Trump Mobile's T1 phone shows signs of Chinese origin despite 'all-American' claims
The Trump Organization unveiled Trump Mobile on June 16, 2025, promoting it as an all-American wireless provider with a flagship T1 phone boasting made-in-USA credentials. However, industry analysts and media reports have cast doubt on those claims, suggesting the T1 may be a rebranded Chinese-made device
Wednesday 18 June 2025
Trump tightens China chip curbs as Nvidia's H20 faces new export limits
The US expanded semiconductor restrictions to include Nvidia's H20 chip, previously the only compliant AI processor available to Chinese buyers, as the Trump administration deepens technology curbs on Beijing
Wednesday 18 June 2025
Korean exporters brace for turmoil as US tariffs and Middle East conflict roil global trade
South Korean exporters are facing mounting pressure from a confluence of geopolitical and trade shocks, as the intensifying conflict between Israel and Iran rattles global commodity markets and new waves of US tariffs threaten key industries, including steel, appliances, and automobiles
Wednesday 18 June 2025
US-Taiwan deepened drone collab to protect defense supply chain from Chinese threats
As the US steps up efforts to secure its unmanned systems supply chain from Chinese influence, Taiwan is emerging as a key potential partner, leveraging its cybersecurity protocols and expanding defense ambitions
Wednesday 18 June 2025
CXMT targets 2027 HBM3E launch as China races to close HBM gap
China continues to lag behind memory giants SK Hynix, Micron, and Samsung Electronics in developing high bandwidth memory (HBM) technology. Although US export controls on semiconductor tools, such as lithography systems, etching equipment, and TSV processes, present long-term barriers, they have had limited short-term impact on China's HBM research and domestic production
Wednesday 18 June 2025
VinFast partners with Global Assure to expand EV customer service network across India
VinFast, a Vietnam-based EV maker, has announced a collaboration with Global Assure to enhance its customer service network throughout India. This partnership aims to provide comprehensive support and innovative mobility solutions to VinFast's expanding customer base in the country, according to an official press release
Wednesday 18 June 2025
Japan's AGC and University of Tokyo unveil laser tech 1 million times faster for AI chip manufacturing

AGC, a leading Japanese manufacturer of specialty glass and ceramics, has partnered with researchers at the University of Tokyo to develop an advanced laser processing technology aimed at semiconductor applications. The new technique, designed for use with glass substrates, dramatically increases processing speeds - by as much as one million times compared to traditional methods

Wednesday 18 June 2025
South Korea names first AI presential secretary
South Korea's presidential office has appointed Ha Jung-woo as its first senior presidential secretary for AI affairs, a newly created role under President Lee Jae-myung's administration. Ha, currently leading Naver Cloud AI Innovation Center, will oversee national AI strategy and budget, directly advising the president, reported ZD Korea and Ddaily
Wednesday 18 June 2025
Canon Machinery targets 2026 launch for hybrid bonding tools amid surge in advanced packaging demand
Canon Machinery, a subsidiary of Japan's Canon Inc., is intensifying its development of hybrid bonding technology as it seeks to expand beyond its conventional die-bonding equipment. The company plans to introduce its advanced packaging solutions to the market after 2026, aiming to meet the increasing demand from leading semiconductor manufacturers