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Wednesday 2 October 2024
Wanzhou Meng returns to Huawei's core leadership, spotlight on Mate 70 launch in her new role
Huawei CFO Wanzhou Meng has resumed her position as rotating chairperson under the company's leadership system, beginning her six-month term on October 1, 2024, which will run until March 31, 2025. This marks her second term in Huawei's top leadership role, where she will oversee both the Board of Directors and the Executive Committee
Wednesday 2 October 2024
Micro Electricity partners with Saigontel for 300 MW solar park in Vietnam
Micro Electricity, an energy services provider, has announced a partnership with Vietnam's Saigon Telecommunications (Saigontel) to jointly develop a 300 MW solar power park and a green energy trading platform for industrial zones in southern Vietnam
Wednesday 2 October 2024
Taiwanese chip makers' cultural sensitivity put to the test in Japan
Cultural sensitivity has not always been a strength of Taiwanese businesses, potentially straining Taiwan-Japan relations as Taiwan's semiconductor ventures expand overseas without fully considering local communities' perspectives
Wednesday 2 October 2024
Foxconn confirms investments in India, likely its OSAT venture with HCL
Foxconn reportedly plans to invest approximately US$50 million in its Outsourced Semiconductor Assembly and Test (OSAT) joint venture with HCL, as India continues to offer attractive subsidies for chipmaking facilities
Tuesday 1 October 2024
South Korea's export growth stays strong on chip demand
South Korea's export momentum stayed robust in September on the back of continued demand for semiconductors, keeping the outlook upbeat for economic growth and offering positive signs for global commerce and the tech cycle
Tuesday 1 October 2024
India-based L&T Semicon anticipates mass production of its first chip within two years
India-based IC design startup L&T Semiconductor Technologies revealed it's developing 15 products, which will be mass-produced in two years and will start the chipmaking business once it reaches a certain threshold in sales
Tuesday 1 October 2024
SK Hynix's debut at TSMC OIP forum showcases HBM3E, H200 breakthrough, boosts Nvidia partnership
SK Hynix recently spotlighted its high-bandwidth memory (HBM) technologies with great emphasis on its collaboration with Nvidia during its participation in TSMC's Open Innovation Platform (OIP) Ecosystem Forum
Tuesday 1 October 2024
Fujifilm doubles down on materials for sub-2nm process nodes
Fujifilm plans to strengthen its semiconductor materials capabilities with an investment of JPY 20 billion (US$ 140 million) to build facilities in Shizuoka and Oita, focusing on materials for sub-2nm chip processes, including photoresist
Tuesday 1 October 2024
Pegatron expands beyond electronics OEM in India, eyes diverse sectors
Pegatron is transforming from a traditional OEM manufacturing solution provider to a comprehensive manufacturing partner, expanding its Indian customer base beyond the electronics sector
Tuesday 1 October 2024
Taiwan's CHEM targets US, Japan as global energy demand rises
Chung-Hsin Electric and Machinery Manufacturing (CHEM) is witnessing substantial growth driven by aggressive capacity expansion, having acquired multiple factories to boost production by approximately 20% annually. The company is focused on the domestic Taiwanese market and is also pursuing opportunities in Japan, the US, and Southeast Asia to enhance its global presence
Tuesday 1 October 2024
Global 300mm fab equipment spending to hit US$400 billion from 2025 to 2027, says SEMI
Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. The robust spending is being driven by the regionalization of semiconductor fabs and the increasing demand for artificial intelligence (AI) chips used in data centers and edge devices
Tuesday 1 October 2024
How China is accelerating advanced packaging with HBM and CoWoS amid tightening US restrictions
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other
Tuesday 1 October 2024
BYD's local integration drives ASEAN market dominance
The ASEAN market, spanning multiple countries, has become a fiercely competitive battleground for numerous automotive and new energy vehicle (NEV) brands. In this landscape, BYD has continued to stand out, which can be attributed to its successful deep integration with local businesses
Tuesday 1 October 2024
Samsung's Vietnam dominance challenged by Chinese rivals
Vietnam, as Samsung Electronics' largest smartphone production base, has seen the company invest over KRW30 trillion (US$22.37 billion) locally over the past 17 years, earning the title of "national enterprise of Vietnam." However, concerns have emerged as Samsung lost its leading position in the Vietnamese smartphone market to Chinese competitors in the second quarter, prompting claims of "Vietnam betraying Samsung.
Tuesday 1 October 2024
Concerns grow over global DDI supply security after US lawmakers target Chinese panel manufacturers
Following recent geopolitical tensions, concerns regarding the supply chain security of technology products have intensified globally. The United States has expressed intentions to impose restrictions on connected vehicles from China
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research