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Monday 27 October 2025
As Huawei stumbles, ByteDance quietly rewrites China’s AI cloud order
Huawei Cloud CEO Zhang Ping'an and several top executives were recently demoted and had their salaries reduced, officially due to "performance falsification." The punishment, however, reflects a broader shift in the AI era: the inseparable link between large models, AI applications, and AI infrastructure. ByteDance's Volcengine has emerged as a key disruptor representing this integrated vision in China's cloud ecosystem
Sunday 26 October 2025
LGES approaches China's battery market with time compression, accumulation strategy
In the face of policy and capital competition pressure from Chinese companies, LG Energy Solution (LGES) is implementing a strategy that combines time compression and accumulation. The "compression" of time refers to AI and digital transformation, while the "accumulation" of time refers to differentiated technology and patents
Sunday 26 October 2025
CXMT, Huawei align on HBM3 ahead of China's 2026 AI memory leap
High-bandwidth memory (HBM) has become the latest competitive front for global DRAM manufacturers. As Samsung, SK Hynix, and Micron gear up for HBM4 mass production in 2026, China's CXMT has reportedly delivered 16nm HBM3 samples to Huawei and its partners, a prelude to large-scale manufacturing slated for the same year
Saturday 25 October 2025
OpenAI, AMD, Broadcom unite behind Ethernet to reshape AI infrastructure
The Ethernet for Scale-Up Networking (ESUN) Alliance officially launched at the 2025 Open Compute Project (OCP) Global Summit, uniting North America's AI heavyweights, including OpenAI, Meta, AMD, Nvidia, Microsoft, and Broadcom. Its goal is to create an open Ethernet interconnect standard to address AI chip connectivity fragmentation and redefine global AI infrastructure. The collaboration marks a rare alignment across major rivals in pursuit of interoperability
Friday 24 October 2025
Korean firm wins top innovation award for transparent 5G/6G antenna technology
Automotive electronics manufacturer THN grabbed a Top Innovation Technology Award here on October 23 at the Future Innovation Technology Expo (FIX 2025) for its breakthrough transparent antenna technology. Dubbed 'FlexClear,' the system aims to enable high-speed, low-latency 5G and 6G connectivity for vehicles without using traditional external antennas. THN was one of nine top winners among thirty companies honored at the Daegu event
Thursday 23 October 2025
Inventec's tie-up with Dixon marks renewed Taiwanese investment in India's electronics supply chain
Inventec, a leading Taiwanese original design manufacturer (ODM), has entered a joint venture with India's Dixon Technologies to produce notebooks (NB), servers, desktops, and electronic components domestically. The new company, Dixon IT Devices Private Limited, will be majority-owned by Dixon (60%), with Inventec holding 40%. The jointly operated factory is scheduled for completion by the second quarter of 2026
Thursday 23 October 2025
Samsung expresses confidence in 2nm development, reports solid progress
Samsung Electronics' Device Solutions (DS) division CTO Song Jae-hyuk expressed strong confidence in the revival of Samsung's foundry business and reported smooth progress on the company's 2nm process during a semiconductor industry briefing hosted by South Korea's chief presidential secretary for policy, Kim Yong-beom
Thursday 23 October 2025
SEDEX 2025: Samsung debuts HBM4; SK Hynix showcases rival design
Samsung Electronics and SK Hynix unveiled their next-generation high-bandwidth memory (HBM4) at SEDEX 2025 in South Korea, marking Samsung's first public display of an HBM4 sample domestically. The launch drew strong attention as the two memory leaders showcased contrasting strategies for the next stage of AI memory development
Thursday 23 October 2025
Analysis: China's EV market awaits BMW's Neue Klasse in 2026
BMW's all-new iX3 — the first SUV on its Neue Klasse electric platform — is drawing strong early blind orders in Germany. But the model's fate will be decided in China, not Europe. And that reckoning begins in 2026
Thursday 23 October 2025
Samsung set to roll out Ballie AI robot in Vietnam with launch imminent
Samsung Electronics is reportedly set to start production of its AI-powered home assistant robot, Ballie, at its facility in Ho Chi Minh City, Vietnam, suggesting that the long-delayed device is finally nearing mass production
Thursday 23 October 2025
Samsung, SK Hynix race to build US chip capacity
As the CHIPS and Science Act drives a shift in global semiconductor investments from Asia to the US, whether South Korean giants Samsung Electronics and SK Hynix can emerge successfully amid rising US–China tensions will depend on their ability to quickly establish stable production in the US, and on government efforts in navigating tariffs and other policies, according to South Korean media reports
Thursday 23 October 2025
China's polarizer push leaves Taiwan rivals fighting for survival
China's Shenzhen Sapo Photoelectric will invest CNY1.334 billion (US$186 million) to build a new LCD and OLED polarizer production line in Shenzhen, worsening an already oversupplied market. With the global display supply chain increasingly concentrated in China, Taiwanese polarizer makers face intensifying pressure to transform
Thursday 23 October 2025
SK Hynix poised to benefit fully from DRAM demand as 'FOMO' rises
SK Hynix is positioned to thoroughly capitalize on the ongoing memory supercycle, driven by its superior DRAM technology and mass production capabilities, according to analysts
Thursday 23 October 2025
Quanta server revenue up 50%, expanding US and Thailand capacities
Quanta Senior Vice President Mike Yang stated that Quanta will continue expanding production capacity in the US and Thailand. Although Taiwan is no longer considering factory expansion, he expects 2025 to once again be an excellent year. Yang shared that Quanta aims to become a collaborator in intelligent production systems
Thursday 23 October 2025
Teco and Foxconn to launch substantial AI data center cooperation in 2026
Teco and Foxconn are advancing their strategic partnership, focusing on AI data centers (AIDC), with plans to initiate concrete collaboration as early as 2026. Teco chairman Morris Li said in an interview on October 22, 2025, that both sides have established a dedicated project team communicating daily, steadily advancing the initiative