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Semiconductor Research

The Semiconductor Report provides structured analysis of the global semiconductor industry, covering technology development, manufacturing, packaging, testing, and supply chain dynamics. The report examines key market trends across logic ICs, memory, advanced packaging, semiconductor equipment, and materials.
It tracks industry developments from chip design and foundry operations to emerging technologies such as AI accelerators, chiplet architectures, and advanced process nodes. The report serves as a practical reference for understanding the evolution of the semiconductor ecosystem and its impact on global technology markets.

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AI accelerators ASIC Foundry OSAT Advanced packaging CPO Memory HBM Smartphone AP

Latest Semiconductor reports

From cHBM to 3D Stacked SRAM, AI inference drives AI accelerators toward memory architecture innovation

DIGITIMES identifies three main directions for memory development in cloud AI accelerators: processing near memory, 3D Stacked SRAM, and high-bandwidth flash.

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BYD leverages in-house semiconductors to power next phase of automotive intelligence; smart driving chip roadmap moves towards 4nm SoC

DIGITIMES notes that BYD Semiconductor's portfolio has expanded from the IGBTs and SiC power chips developed to meet early electric vehicle (EV) demand into high-computing-power smart-driving SoCs.

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Global smartphone AP industry, 2Q 2026: 2nm and memory costs to weigh on 3Q26 shipments

Global smartphone AP industry, 2Q 2026: 2nm and memory costs to weigh on 3Q26 shipments

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Taiwan, US, and China OSAT strategies diverge as industry shifts toward capacity expansion, supply chain restructuring, and next-generation packaging

Taiwan, US, and China OSAT strategies diverge as industry shifts toward capacity expansion, supply chain restructuring, and next-generation packaging

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TGV still faces technical barriers; CoPoS commercialization not likely until 2030

TGV still faces technical barriers; CoPoS commercialization not likely until 2030

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Megawatt AI Racks: Infrastructure Evolution & Wide-Bandgap Power Semiconductor Opportunities by 2030

Megawatt AI Racks: Infrastructure Evolution & Wide-Bandgap Power Semiconductor Opportunities by 2030

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Competing Paths in Data Center Optics: XPO Could Beat CPO to Mass Production in 2027

Competing Paths in Data Center Optics: XPO Could Beat CPO to Mass Production in 2027

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Global top-3 memory maker status, 2Q 2026: Surging prices and AI demand lock in a strong memory seller's market

Memory makers' revenues are estimated to hit another record high in the second quarter of 2026; The US, Japan, and South Korea launch new product competitions, while Taiwanese players continue to pursue niche market momentum.

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Display to semiconductor: Panel makers weaponize large glass substrates for FOPLP

Panel makers' FOPLP strategies vary, with Innolux being the most active. AUO utilizes RDL technology to develop emerging applications such as satellite antennas.

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Taiwan, China wafer foundry industry, 2Q 2026: Cross-strait revenues to surge over 25%

Taiwan and China's wafer foundry industry off-season was not slow, and the price hike effect will drive up cross-strait industry revenues in the second quarter of 2026 and full-year 2026.

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