The Semiconductor Report provides structured analysis of the global semiconductor industry, covering technology development, manufacturing, packaging, testing, and supply chain dynamics. The report examines key market trends across logic ICs, memory, advanced packaging, semiconductor equipment, and materials.
It tracks industry developments from chip design and foundry operations to emerging technologies such as AI accelerators, chiplet architectures, and advanced process nodes. The report serves as a practical reference for understanding the evolution of the semiconductor ecosystem and its impact on global technology markets.
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According to DIGITIMES, Agentic AI, AI server expansion, cloud service provider (CSP) in-house CPU ramp-up, and replacement demand for general-purpose servers will lift global server CPU shipments to 52.6 million units in 2027, up 45.7% year-over-year, with x86 and Arm architectures rising 35.3% and 79.1%, respectively.
DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year.
DIGITIMES has observed that since Tesla equipped the Model 3 with a traction inverter integrated with SiC power modules in 2018, the application of SiC power devices in the electric vehicle (EV) sector has gradually expanded, prompting suppliers to aggressively ramp up capacity.
DIGITIMES observes that major memory suppliers posted record-high revenue in the second quarter of 2026, with yearover-year growth remaining in the triple digits. Driven by AI demand, SSDs and LPDDR are emerging as key competitive
battlegrounds.
DIGITIMES identifies three main directions for memory development in cloud AI accelerators: processing near memory, 3D Stacked SRAM, and high-bandwidth flash.
DIGITIMES notes that BYD Semiconductor's portfolio has expanded from the IGBTs and SiC power chips developed to meet early electric vehicle (EV) demand into high-computing-power smart-driving SoCs.
Global smartphone AP industry, 2Q 2026: 2nm and memory costs to weigh on 3Q26 shipments
Taiwan, US, and China OSAT strategies diverge as industry shifts toward capacity expansion, supply chain restructuring, and next-generation packaging
TGV still faces technical barriers; CoPoS commercialization not likely until 2030
Megawatt AI Racks: Infrastructure Evolution & Wide-Bandgap Power Semiconductor Opportunities by 2030