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Tuesday 24 October 2017
Qualcomm gains further share of smartphone AP market in 1H17, says Strategy Analytics
The global smartphone applications processor (AP) market declined 5% on year to reach US$9.4 billion in the first half of 2017, according to Strategy Analytics. Qualcomm maintained...
Thursday 19 October 2017
TSMC 3Q17 profits slip
Taiwan Semiconductor Manufacturing Company (TSMC) has reported net profits of NT$89.93 billion (US$2.97 billion) on consolidated revenues of NT$252.11 billion for the third quarter...
Thursday 19 October 2017
Samsung completes qualification of 8LPP process
Samsung Electronics' 8nm FinFET process technology, the 8LPP (Low Power Plus), has been qualified and is ready for production, according to the company.
Wednesday 18 October 2017
HiSilicon seeking second-source supplier for 7nm chips
HiSilicon Technologies is seeking a second-source supplier for the fabrication of its 7nm chips, with Samsung Electronics, Globalfoundries and Intel striving for orders from the China-based...
Friday 6 October 2017
Intel readies Coffee Lake lineup
Intel has released its Coffee Lake-based 14nm desktop processors including Core i7-8700K/8700, Core i5-8600K/8400 and Core i3-8350K/8100, as well as the corresponding Z370 chipsets...
Monday 2 October 2017
Staying focused on profitability: Q&A with UMC co-president SC Chien
United Microelectronics (UMC) recently disclosed plans to expand its 28nm process offering by launching 28nm HPC and 28nm HPC Plus nodes, and introduce a further improved version...
Monday 25 September 2017
Taiwan IC backend firms to enjoy strong 4Q17
A ramp-up of orders for communications chips, as well as TV panel-use driver ICs and TDDI (touch with display driver) chips, will enable Taiwan-based IC backend firms to enjoy a particularly...
Friday 22 September 2017
Globalfoundries to roll out 12nm FinFET technology for high-performance devices
Globalfoundries has announced plans to introduce a new 12nm leading-performance (12LP) FinFET semiconductor manufacturing process. The technology is expected to deliver better density...
Wednesday 20 September 2017
Leading-edge paves way for pure-play foundry growth, says IC Insights
In 2017, the 7% increase in the total pure-play foundry market is forecast to be almost entirely due to an 18% jump in sub-40nm feature size device sales, according to IC Insights.
Wednesday 20 September 2017
Intel GPU-integrated Cannon Lake may not be ready until year-end 2018, say sources
Intel has reportedly rescheduled the releases for some of its next-generation Cannon Lake-based processors, mostly ones with an integrated GPU, to the end of 2018, which has already...
Wednesday 20 September 2017
Intel provides 10nm updates, plan for 10nm FPGA
Intel has provided updates for its 10nm process and plans for 10nm FPGAs, as well as the availability of its 64-layer 3D NAND for data center applications. The disclosures were made...
Monday 18 September 2017
SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology
China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...
Friday 15 September 2017
CHPT testing solutions for 7nm chips ready for mass shipments in 2H18
IC testing solution provider Chunghwa Precision Test Technology (CHPT) expects to start mass shipments of solutions for the manufacture of 7nm chips in the second half of 2018. Shipments...
Thursday 14 September 2017
SEMICON Taiwan 2017: Brewer Science showcasing innovative materials for EUV and 3D IC manufacturing
With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...
Thursday 14 September 2017
MediaTek to lag in advanced-node chip race
MediaTek is unlikely to roll out mobile chips built using more advanced 10nm and 7nm process technologies in 2018, as it has moved to focus on the mid-range smartphone market segment,...