The new Samsung Galaxy S9+ equipped with 64GB of NAND flash memory (model number SM-G965U1) carries a bill of materials (BOM) cost of US$375.80, much higher than for previous versions...
Samsung Electronics has announced the availability of its latest application processor (AP), the Exynos 7 Series 9610, built using the company's 10nm FinFET process.
TSMC's 16nm and 12nm process production capacity has been tight in the first quarter of 2018 driven by strong demand for GPUs and ASICs for cryptocurrency mining, according to industry...
DRAM maker Nanya Technology is engaged in the research and development of 10nm process technology which will be targeted mainly at server and data center applications, according to...
The success and proliferation of integrated circuits has largely hinged on the ability of IC manufacturers to continue offering more performance and functionality for the money, according...
Major China-based OSAT companies including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Tianshui Huatian Technology are all gearing up to compete...
Toppan Photomasks has announced that additional investment will be made in new, leading-edge equipment for mass production of advanced photomasks at Toppan Photomasks Company Shanghai...
China's major AI chipmakers, including HiSilicon, Cambricon Technologies, Horizon Robotics and DeePhi Tech, are expected to reap rich harvests in 2018 from their launch of various...
Taiwan wafer foundry revenues for the fourth quarter of 2017 are estimated to surge 7.8% sequentially and 9.3% on year to US$10.54 billion, with the growth mainly seen in revenues...
Globalfoundries (GF) will have its 12-inch wafer fabs in Dresden, Germany focus on using FD-SOI (fully-depleted silicon-on-insulator) process technology to fabricate automotive-use...
Samsung Electronics announced recently that its foundry business has commenced mass production of system-on-chip (SoC) products built on its second generation 10nm FinFET process...
Speculation circulated recently in the chipmaking industry that Taiwan Semiconductor Manufacturing Company (TSMC) is gearing up for 7nm chip production for Apple's in-house designed...
After spending US$11.3 billion in semiconductor capex last year, Samsung announced that its 2017 outlays for the semiconductor group are expected to more than double to US$26 billion...
Samsung expects capital expenditure (capex) for 2017 to be approximately KRW46.2 trillion (US$41.5 billion), a significant increase from 2016. Capex for the semiconductor and display...
