Globalfoundries has disclosed plans to cut 5% of its global workforce, or about 900 employees, with the layoff to take place mainly in Europe and the US.
As one of the main districts under the administration of Chengdu, the capital city of Sichuan Province, and with a robust industry carrier, the Shuangliu District is aggressively...
Taiwan-based IC design houses have expressed caution about their gross margin performance in the second half of 2018, as they will encounter rising costs including higher quotes asked...
Globalfoundries has denied recent rumors indicating the company is looking for a strategic partner or buyer to transfer the ownership of its 12-inch wafer plant in Chengdu, China.
Pure-play foundries in China and Taiwan intend to encourage their fabless firms to transition to 12-inch wafer manufacturing as their 8-inch fab capacity has been extremely tight,...
Bitmain has reportedly placed DRAM orders mainly for low-capacity DDR3 chips with Taiwan-based memory design specialists Elite Semiconductor Memory Technology (ESMT) and Etron Technology,...
Foundry chipmaker Powerchip Technology plans to build a new 12-inch wafer plant in the Tongluo campus of Hsinchu Science Park (HSP) in Miaoli, northern Taiwan with total investment...
Foxconn Electronics (Hon Hai Precision Industry) has set up a semiconductor subgroup, which is mulling 12-inch fab construction, industry sources have claimed.
Silicon wafer company GlobalWafers has struck a deal with a provincial government in South Korea for expansion of its local plant in Cheonan, South Chungcheong, according to a report...
IC packager Siliconware Precision Industries' (SPIL) Jinjiang plant in Fujian, China will initially focus on providing backend services for DRAM memory, and will start generating...
Taiwan's clean room engineering specialist Acter has reported clear order visibility through the first half of 2019 thanks to robust demand from overseas semiconductor firms and LCD...
Micron Technology is adding a new facility to its existing 12-inch wafer plant for the manufacture of NAND flash memory in Singapore. The new facility is expected to come online by...
The InFO WLP (integrated fan-out wafer level packaging) and CoWoS (chip on wafer on substrate) developed by Taiwan Semiconductor Manufacturing Company (TSMC) have emerged as two major...
Major IC packaging and testing players are actively developing an advanced fan-out panel level packaging (FOPLP) technology that can package chips on panels larger than 8-inch or...
