South Korea's parliament passed the "Act on the Development of Artificial Intelligence and Establishing a Trustworthy Foundation" (AI Basic Act) on December 26, 2024, establishing...
Japan's Ministry of Economy, Trade, and Industry (METI) has allocated JPY100 billion (US$638 million) in its fiscal 2025 budget proposal (April 2025 to March 2026) to support domestic...
TSMC is leveraging strong demand for sub-7nm advanced processes and its exclusive CoWoS packaging services, emerging as the leading beneficiary of the AI boom in 2024. Despite a slow...
US chip designer Synaptics Inc. aims to assemble and package at least 10% of its chips in India by 2027 to diversify its supply chain and reduce dependency on China.
Japan's leading semiconductor materials manufacturers are making strategic moves to develop crucial components for 1-nanometer chip production, positioning themselves at the forefront...
Taiwan's self-developed Triton satellite entered orbit on October 9, 2023, launched aboard Arianespace's VEGA rocket from French Guiana. Despite logistical and health challenges posed...
Japan Display Inc. (JDI) has formed a strategic partnership with Taiwanese display manufacturer Innolux Corporation and its automotive subsidiary CarUX to develop next-generation...
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...
The AI agent market is witnessing explosive growth as leading players, including Microsoft, Apple, Zhipu, and Huawei, race to solidify their positions. At the Baidu World 2024 conference,...
STMicroelectronics (STM) has revised its growth targets amid persistent weak demand for chips used in automotive and industrial applications. During its Capital Markets Day in Paris,...
The Japanese government is preparing to provide over JPY10 trillion (approx. US$65 billion) in support for the semiconductor and AI industries by the fiscal year 2030 (April 2030...
Reports from Kyodo and Nikkei indicate that the Japanese government intends to invest around JPY200 billion (approx. US$1.3 billion) in Rapidus during the fiscal...
Samsung Electronics is reportedly set to launch high-capacity and high-heat-dissipation Bonding Vertical (BV) NAND Flash with more than 400 layers in 2026. This move aims to enhance...
Nikon has announced plans to launch exposure equipment for the back-end semiconductor process in fiscal year 2026 (April 2026 to March 2027), utilizing a photomask-free approach,...
China's quantum technology ambitions are gaining momentum as Huawei's venture capital arm makes a strategic investment in quantum measurement specialist China Quantum Measurement...
