The global IC design market is expanding rapidly, driven by the growth of AI. However, South Korea's system semiconductor sector, which currently holds a modest 2% market share, faces...
TSMC is advancing its compact optical engine technology, branded as COUPE, a top priority among its emerging innovations. Nvidia CEO Jensen Huang, during a recent visit to Taiwan,...
Samsung Electro-Mechanics is teaming up with South Korean semiconductor materials company SoulBrain to develop materials for glass substrates, with plans for mass production by 2027...
On January 14, Advanced Micro-Fabrication Equipment (AMEC) projected 2024 revenue of CNY9.065 billion (US$1.237 billion), reflecting a 44.73% increase compared to the previous year...
Japanese foundry Rapidus is preparing to provide 2nm chip samples to US semiconductor giant Broadcom, after it began trial production, which is scheduled for April 2025 and mass production...
South Korea's parliament passed the "Act on the Development of Artificial Intelligence and Establishing a Trustworthy Foundation" (AI Basic Act) on December 26, 2024, establishing...
Japan's Ministry of Economy, Trade, and Industry (METI) has allocated JPY100 billion (US$638 million) in its fiscal 2025 budget proposal (April 2025 to March 2026) to support domestic...
TSMC is leveraging strong demand for sub-7nm advanced processes and its exclusive CoWoS packaging services, emerging as the leading beneficiary of the AI boom in 2024. Despite a slow...
US chip designer Synaptics Inc. aims to assemble and package at least 10% of its chips in India by 2027 to diversify its supply chain and reduce dependency on China.
Japan's leading semiconductor materials manufacturers are making strategic moves to develop crucial components for 1-nanometer chip production, positioning themselves at the forefront...
Taiwan's self-developed Triton satellite entered orbit on October 9, 2023, launched aboard Arianespace's VEGA rocket from French Guiana. Despite logistical and health challenges posed...
Japan Display Inc. (JDI) has formed a strategic partnership with Taiwanese display manufacturer Innolux Corporation and its automotive subsidiary CarUX to develop next-generation...
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...
The AI agent market is witnessing explosive growth as leading players, including Microsoft, Apple, Zhipu, and Huawei, race to solidify their positions. At the Baidu World 2024 conference,...