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NEWS TAGGED 2027
Tuesday 22 October 2024
Intel, Japan's AIST invest US$700 million in advanced semiconductor hub
Japan's National Institute of Advanced Industrial Science and Technology (AIST) is teaming up with Intel to build a cutting-edge semiconductor research hub, backed by a JPY 100 billion...
Wednesday 16 October 2024
TsangYow sees growth from AM market recovery; Malaysia plant set for 2027 launch
TsangYow, a major transmission system manufacturer, is experiencing positive growth due to the recovery of the aftermarket (AM) component market. The company's monthly revenue continues...
Thursday 3 October 2024
Rapidus struggles to secure funding amidst 2nm chip ambitions
Rapidus, a Japanese semiconductor startup aiming to mass-produce 2nm chips by 2027, faces significant funding, technology, and market competitiveness challenges.
Tuesday 1 October 2024
Global 300mm fab equipment spending to hit US$400 billion from 2025 to 2027, says SEMI
Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. The robust spending is being driven by the regionalization...
Thursday 26 September 2024
Thailand to build first SiC facility, with operation expected by 2027
Thailand is set to make a significant stride in the semiconductor industry with the establishment of its first silicon carbide (SiC) wafer factory, which is expected to begin operation...
Tuesday 24 September 2024
Lenovo revs up F1 partnership, commits US$1 billion to AI innovation over next three years
Lenovo Group has recently renewed its partnership with Formula 1 (F1), underscoring the growing significance of AI technology in motorsports. The collaboration, initially established...
Friday 20 September 2024
Rapidus supply chain is taking shape; Taiyo Nippon Sanso to supply gases within 2024
The supply chain for Japanese semiconductor company Rapidus is preparing to start supplying goods as construction of Rapidus' wafer fab nears completion.
Wednesday 18 September 2024
E Ink Prism's dynamic technology set to redefine automotive and consumer electronics
BMW is driving innovation in automotive design with its integration of E Ink Prism's color-shifting electronic paper, first showcased at CES 2022. The concept car, which could transition...
Monday 16 September 2024
Samsung secures new automotive customer for its 2nm process; expects mass production in late 2026
Samsung has secured US-based imaging chip company Ambarella as a customer for its 2nm process. Samsung will produce Ambarella's advanced driving assistance system (ADAS) chips, with...
Wednesday 11 September 2024
Taiwan pushes its own Starlink as satellite launch delayed to 2027
Taiwan's government has officially committed to developing its own version of "Starlink" as part of its "Five Trusted Industry Sectors" initiative. The launch of the country's first...
Thursday 5 September 2024
VIS-NXP 12-inch wafer fab in Singapore approved
In June 2024, Vanguard International Semiconductor (VIS) and NXP unveiled plans to collaborate on establishing VSMC in Singapore, where they will build a 12-inch wafer fabrication...
Tuesday 3 September 2024
Semiconductor equipment spending in China to fall amid new rising forces
Semiconductor equipment spending in China is poised to fall throughout 2027 while new forces emerge in Europe, Japan, and the US, where spending will surge, according to SEMI.
Friday 30 August 2024
Meta reportedly developing glasses-like MR device; expects to launch in 2027
It was previously reported that Meta Platforms has canceled its planned high-end mixed reality (MR) headset project, internally codenamed "La Jolla," originally slated for release...
Wednesday 28 August 2024
Rapidus pursues US$690 million loan to achieve 2nm chip production by 2027
Rapidus, aiming to begin mass production of 2-nanometer chips in Japan by 2027, is seeking significant financial support for its trial production and eventual mass production.
Tuesday 20 August 2024
Challenges ahead for Europe's first 12-inch wafer fab
Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research