The most consequential figures on HPE's fiscal third-quarter earnings call on September 2 were not the results but the commitments standing behind them. According to Bloomberg's transcript...
Hewlett Packard Enterprise's fiscal third-quarter results, reported on September 2, are the point at which the Juniper Networks deal and the enterprise AI cycle stopped being a cost...
Cooling specialist Auras Technology is expanding from GPU platforms to ASIC-related products as its next growth driver, amid the ongoing shift toward liquid cooling in AI servers,...
JPC Connectivity said demand tied to artificial intelligence infrastructure continued to strengthen in the second quarter of 2026, lifting orders for optical communications, high-speed...
Samsung Electro-Mechanics (SEMCO) is set to expand the scope of its price increases, with market reports saying the company will raise direct-supply prices for multilayer ceramic capacitors...
TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...
Marvell SVP and chief technology officer Radha Nagarajan offered a clearer timeline for the commercialisation of co-packaged optics, or CPO, during a media briefing at Semicon Taiwan...
Japan's Panasonic has raised PCB material prices for the second time in 2026, broadening the increases to copper-clad laminate (CCL), pre-preg (PP) and other products, including IC...
The US is rapidly reshaping the cost structure of its solar supply chain under Section 232 of the Trade Expansion Act of 1962. According to a recent webinar hosted by Intertek CEA,...
Taiwan's carbon fee has been formally included in the UK government's list of Qualifying Carbon Pricing Schemes (QCPS) under its Carbon Border Adjustment Mechanism (CBAM), alongside...
Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...
Samsung Electro-Mechanics disclosed on September 1 that it has concluded a single sales and supply contract worth KRW1.072 trillion (about US$778.9 million) for MLCCs, equal to 9.5%...
TSMC's reported delay in placing 2027 advanced packaging equipment orders has sparked market speculation that the company sees excess CoWoS capacity ahead. But equipment suppliers...
China's leading DRAM maker CXMT has reportedly begun small-volume production of HBM3E, a step that could ease one of the most important hardware constraints on China's domestic AI...
Semicon Taiwan 2026 is set to open soon as Semiconductor Equipment and Materials International said AI is pushing a new wave of technology upgrades across the global chip industry...
