Foxconn chairman Young Liu said at a media briefing following Hon Hai Tech Day (HHTD 26) on October 30 that the long-term AI industry trend remains intact, but the overall market will...
Nytex Composites, a Taiwan-based specialty plastics compounder, aims to increase high-end materials' share of revenue to 35% in 2027, up from 25.76% in the first half of 2026, as demand...
Samsung Electronics' contract chipmaking business spent years struggling to fill its factories. On its third-quarter earnings call, the company said that by 2027, demand will exceed...
Radiant Opto-Electronics, a major backlight module maker, is expanding into new businesses and targeting next-generation optical communications architecture, particularly co-packaged...
Honda Motor plans to achieve Level 4 autonomous driving around 2027 and replace high-definition maps with AI technology around 2030, enabling Level 4 vehicles to navigate the narrow...
Micron Technology paid its fiscal 2026 bonuses to Taiwan employees on October 30. The company said more than 700 production-line workers earned at least five years' worth of monthly...
Realtek Semiconductor quantified its AI business for the first time at an investor conference on October 29, setting a target for high-performance computing (HPC) and edge AI revenue—including...
Speaking at Hon Hai Tech Day (HHTD 26), Kazunori Tanaka, Representative Director and President of Mitsubishi Electric Mobility, emphasized that the company's core competitiveness in...
Microcontroller unit (MCU) major Holtek Semiconductor has secured a substantial order for brushless DC (BLDC) motors, with adoption in Taiwanese server cooling fans slated to begin...
Eutelsat said that it predicts at least EUR10 billion (US$11.2 billion) in revenue from 2032 to 2040 as it leads the EU's low Earth orbit (LEO) network initiative IRIS2. The European...
ASE Technology Holding (ASEH) expects gross margins in its packaging and testing business to remain above 30% in 2027 as growing demand for AI-related advanced packaging helps the...
Amazon expects its cloud unit to keep growing faster than 40% a year through 2028, even as costs from its satellite internet project hold back fourth-quarter profit.
Passive component manufacturer Yageo said robust AI demand is driving shipments of multilayer ceramic capacitors (MLCCs) and tantalum capacitors, pushing AI-related applications to...
Oracle will offer cloud services powered by Cerebras' AI computing systems in its cloud data centers starting in 2027, giving the wafer-scale chipmaker another major cloud customer...
AI chipmakers' rising memory performance requirements are accelerating the shift from sixth-generation high-bandwidth memory (HBM4) to HBM4E, according to analysis of the South Korean...
