BMW is driving innovation in automotive design with its integration of E Ink Prism's color-shifting electronic paper, first showcased at CES 2022. The concept car, which could transition...
Samsung has secured US-based imaging chip company Ambarella as a customer for its 2nm process. Samsung will produce Ambarella's advanced driving assistance system (ADAS) chips, with...
Taiwan's government has officially committed to developing its own version of "Starlink" as part of its "Five Trusted Industry Sectors" initiative. The launch of the country's first...
In June 2024, Vanguard International Semiconductor (VIS) and NXP unveiled plans to collaborate on establishing VSMC in Singapore, where they will build a 12-inch wafer fabrication...
Semiconductor equipment spending in China is poised to fall throughout 2027 while new forces emerge in Europe, Japan, and the US, where spending will surge, according to SEMI.
It was previously reported that Meta Platforms has canceled its planned high-end mixed reality (MR) headset project, internally codenamed "La Jolla," originally slated for release...
Rapidus, aiming to begin mass production of 2-nanometer chips in Japan by 2027, is seeking significant financial support for its trial production and eventual mass production.
Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...
TSMC has been placing large volumes of orders for production equipment and factory engineering projects in support of its fast capacity expansion, dispelling skepticism about the...
TSMC Chairman C.C. Wei is set to lead the groundbreaking ceremony for the European Semiconductor Manufacturing Company (ESMC) in Dresden, Germany, on August 20, 2024.
Asus has released its operating performance for the second quarter of 2024, revealing profits that exceeded market expectations. Co-heads Jackie Hsu and Samson Hu expressed optimism...
Luca Rossi, president of Lenovo's Intelligent Devices Group (IDG), stated that all Lenovo PC products will feature AI functions by 2027. Additionally, Lenovo aims to enhance its smartphone...
SK Hynix has announced board approval for a KRW9.4 trillion (approximately US$6.77 billion) investment to construct its first plant and related operational facilities at the Yongin...
TSMC has made a production roadmap for using high-NA EUV lithography equipment to make 1.4nm chips starting as early as 2028, according to industry sources.
