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NEWS TAGGED 300MM
Tuesday 1 October 2024
Global 300mm fab equipment spending to hit US$400 billion from 2025 to 2027, says SEMI
Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. The robust spending is being driven by the regionalization...
Thursday 12 September 2024
Infineon develops 300mm GaN technology
Infineon Technologies has announced the development of the world's first 300mm power gallium nitride (GaN) wafer technology. The company claims to be the first to effectively implement...
Friday 23 August 2024
Mitsubishi Materials develops world's largest rectangular silicon substrate for AI chips
Mitsubishi Materials has announced the development of the world's largest rectangular silicon substrate, a technology gaining attention due to advancements in advanced packaging....
Monday 19 August 2024
TI to receive up to US$1.6 billion in CHIPS Act funding
Texas Instruments (TI) and the US Department of Commerce have signed a non-binding preliminary memorandum of terms for up to US$1.6 billion in proposed direct funding under the CHIPS...
Tuesday 6 August 2024
Silicon wafer shipments increase in 2Q24
Worldwide silicon wafer shipments increased 7.1% quarter-on-quarter to 3.035 billion square inches in the second quarter of 2024, but saw an 8.9% decline from the 3.33 billion square...
Monday 29 July 2024
OSATs expect sales growth in 2H24
Semiconductor backend services providers generally believe sales will improve in the second half of 2024, but the strength of the growth momentum remains to be seen.
Wednesday 24 July 2024
TI results offer hope amid 300mm capacity expansion for enhanced resilience
Texas Instruments (TI) provided financial guidance that is slightly lower than expectations. The company's capital expenditure (Capex) plan is progressing smoothly, indicating significant...
Wednesday 24 July 2024
TSMC said to adopt larger glass substrates for FOPLP
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
Wednesday 17 July 2024
GlobalWafers receives US$400 million of CHIPS Act funding
On July 17, the Biden-Harris Administration announced a non-binding Preliminary Memorandum of Terms (PMT) between the US Department of Commerce and GlobalWafers America, LLC and MEMC...
Wednesday 26 June 2024
Synopsys expected to provide automation and analytics tools for Tata Electronics chipmaking facilities in India
Following the collaboration with Taiwan-based PSMC to build a 300mm wafer fab in India, Tata Electronics plans to expedite the operation of the fab with tools provided by Synopsys.
Friday 14 June 2024
London Tech Week live: UK's semiconductor industry and TSMC in the spotlight
London Tech Week has brought significant attention to generative AI and the UK's evolving semiconductor industry. This event underscores Britain's ambition to enhance its position...
Wednesday 5 June 2024
NXP, VIS team up for 300nm JV fab in Singapore
NXP Semiconductors and Taiwan-based specialty IC foundry Vanguard International Semiconductor (VIS) have announced plans to create a manufacturing joint venture, VisionPower Semiconductor...
Friday 24 May 2024
Toshiba completes new 300mm fab for power semiconductors
Toshiba Electronic Devices & Storage recently hosted a ceremony to commemorate the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an...
Wednesday 20 March 2024
SEMI expects record US$137 billion in 300mm fab equipment spending in 2027
Global 300mm fab equipment spending for front-end facilities is forecast to reach a record US$137 billion in 2027, after topping US$100 billion for the first time in 2025, driven...
Monday 11 March 2024
Applied Materials commissions facility able to process 300mm wafers in India
US-based semiconductor equipment manufacturer, Applied Materials, inaugurated a validation center in India, the first commercial facility to process 300mm wafers in the country.
CHT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research