Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. The robust spending is being driven by the regionalization...
Infineon Technologies has announced the development of the world's first 300mm power gallium nitride (GaN) wafer technology. The company claims to be the first to effectively implement...
Mitsubishi Materials has announced the development of the world's largest rectangular silicon substrate, a technology gaining attention due to advancements in advanced packaging....
Texas Instruments (TI) and the US Department of Commerce have signed a non-binding preliminary memorandum of terms for up to US$1.6 billion in proposed direct funding under the CHIPS...
Worldwide silicon wafer shipments increased 7.1% quarter-on-quarter to 3.035 billion square inches in the second quarter of 2024, but saw an 8.9% decline from the 3.33 billion square...
Semiconductor backend services providers generally believe sales will improve in the second half of 2024, but the strength of the growth momentum remains to be seen.
Texas Instruments (TI) provided financial guidance that is slightly lower than expectations. The company's capital expenditure (Capex) plan is progressing smoothly, indicating significant...
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
On July 17, the Biden-Harris Administration announced a non-binding Preliminary Memorandum of Terms (PMT) between the US Department of Commerce and GlobalWafers America, LLC and MEMC...
Following the collaboration with Taiwan-based PSMC to build a 300mm wafer fab in India, Tata Electronics plans to expedite the operation of the fab with tools provided by Synopsys.
London Tech Week has brought significant attention to generative AI and the UK's evolving semiconductor industry. This event underscores Britain's ambition to enhance its position...
NXP Semiconductors and Taiwan-based specialty IC foundry Vanguard International Semiconductor (VIS) have announced plans to create a manufacturing joint venture, VisionPower Semiconductor...
Toshiba Electronic Devices & Storage recently hosted a ceremony to commemorate the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an...
Global 300mm fab equipment spending for front-end facilities is forecast to reach a record US$137 billion in 2027, after topping US$100 billion for the first time in 2025, driven...
US-based semiconductor equipment manufacturer, Applied Materials, inaugurated a validation center in India, the first commercial facility to process 300mm wafers in the country.
