Taiwan Semiconductor Manufacturing Company (TSMC) reportedly plans to team up with Micron Technology to develop 3D ICs that will integrate Micron's hybrid memory cube-based DRAM chips...

Advanced Semiconductor Engineering (ASE) reportedly plans to team up with Inotera Memories to set up a joint venture for handling TSV (through-silicon via) 3D IC packaging.

Austria-based ams, a provider of high performance analog ICs and sensor solutions, has announced plans to invest over EUR25 million (US$33 million) to install 3D IC production capacity...

Micron Technology is striving to establish strategic cooperation with Taiwan-based contract chipmakers, according to company CEO Mark Durcan. Companies such as Taiwan Semiconductor...

Taiwan-based memory packaging/testing company Powertech Technology (PTI) and wafer foundry United Microelectronics (UMC) as well as Japan-based DRAM maker Elpida Memory on May 30...

3D IC Technology holds great promise for manufacturing at 20nm and beyond, bridging the gap between SoC and future system requirements. Because of its high technical thresholds, integrated...

Unlike conventional SoC or SiP solutions that integrate ICs on a two-dimensional (2D) surface, using through silicon via (TSV) technology in a package that stacks ICs in a three-dimensional...