TSMC has announced the Open Innovation Platform (OIP) 3DFabric Alliance to help customers achieve fast implementation of silicon and system-level innovations and enable next-generation...

MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...

Intel has disclosed plans to hike its CPU prices by 10-20% starting October, but AMD is not expected to follow suit amid the waning terminal market demand, according to industry so...

TSMC is on track to develop InFO_3D technology for processing mobile device chips that are going slimmer and lighter, looking to further expand its 3D Fabric lineup and serve more...

Heavyweight semiconductor players including sole EUV lithography equipment vendor ASML and top foundry TSMC have lately shed lights on latest front-end lithography and backend advanced...

Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...

While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...