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NEWS TAGGED 3NM
Monday 9 February 2026
TSMC supports Japan's advanced packaging plant construction
TSMC chairman C.C. Wei recently visited Japan and appeared alongside Prime Minister Sanae Takaichi to jointly announce that Kumamoto Fab 2 will be upgraded from a 6nm to a 3nm process,...
Monday 9 February 2026
Taiwan posts fastest growth in 15 years as AI boom drowns out hollowing-out fears
Taiwan's economy expanded 8.63% in 2025, its strongest growth in 15 years, as the island's semiconductor-driven supply chain continued to underpin global demand for AI computing. Minister...
Saturday 7 February 2026
A close reading of the book behind TSMC's Japan bet
TSMC's decision to bring 3nm manufacturing to Japan is often explained in terms of subsidies and diversification. A better explanation sits in a book written five years ago by Prime...
Friday 6 February 2026
TSMC’s 3nm bet in Japan signals a deeper Taiwan-Japan tech pact
To meet the surging demand driven by AI, TSMC is upgrading its second wafer fab under construction in Kumamoto, Japan, to use more advanced 3nm process technology. This development...
Friday 6 February 2026
The Kumamoto master plan: behind TSMC's strategic leap to 3nm supremacy
TSMC is doubling down on Japan. By upgrading its second Kumamoto facility to 3-nanometer production, the chipmaking giant has turned what was once a secondary supply-chain hedge into...
Friday 6 February 2026
Commentary: Why TSMC is upgrading Japan's Kumamoto fab from 6nm to 3nm
TSMC has made a significant change in its process plan for the Kumamoto second fab, confirming an upgrade from the initially planned 6/7nm node to 3nm. This facility will become Japan's...
Thursday 5 February 2026
The 3nm surprise: TSMC's C.C. Wei pulls PM Takaichi's own book from his pocket to seal US$17B deal
In a moment that blurred the lines between corporate diplomacy and fan-like devotion, TSMC CEO C.C. Wei turned a high-stakes semiconductor summit into a personal tribute on February...
Thursday 5 February 2026
Commentary: How TSMC's C.C. Wei solidifies global alliances from Washington to Tokyo
In the high-stakes theater of global chipmaking, TSMC Chairman C.C. Wei has mastered a rare skill: the art of the well-timed strategic masterstroke.
Thursday 5 February 2026
TSMC goes all-in on Japan: Kumamoto Fab 2 upgraded to 3nm powerhouse
TSMC has formulated a plan to mass-produce advanced 3nm chips in Kumamoto Prefecture, marking an unprecedented move within Japan. The company has notified the Japanese government of...
Tuesday 3 February 2026
Alchip, GUC, and Faraday eye 2026 growth on US CSP chip orders
Alchip, Global Unichip (GUC), and Faraday each hold unique strengths as leading ASIC design service providers. Benefiting from major US cloud service providers' (CSPs) push for in-house...
Monday 2 February 2026
TSMC revises five-year growth plan, turning tech lead into high profits
TSMC chairman C.C. Wei recently confirmed that AI demand is real and the trend will remain unchanged in the coming years. AI accelerators accounted for a "high double-digit" percentage...
Tuesday 27 January 2026
TSMC's capex surprise reveals blind spots in semiconductor forecasting
TSMC's recently announced capex surpassed market expectations by US$6 billion to US$8 billion, driven by factors that analysts had previously overlooked, DIGITIMES analyst Luke Lin...
Monday 19 January 2026
TSMC eyes rapid 2nm growth in 2026 through high capex and US-Taiwan expansion
TSMC posted record fourth quarter 2025 results driven by strong demand for its 3nm and 5nm process families, with a gross margin of 62.3%, surpassing prior guidance of 59-61%. The...
Monday 19 January 2026
China's Innosilicon launches LPDDR6 IP with commercial shipments
As AI smartphones and AI PCs surge, end devices demand unprecedented memory bandwidth. Recently, Chinese interface IP provider Innosilicon announced that its self-developed LPDDR6/5X...
Friday 16 January 2026
Xiaomi reportedly skips 2nm for Xring O2, chooses TSMC 3nm to cut costs

Xiaomi's second-generation in-house mobile processor, the Xring O2, will skip TSMC's 2nm process and instead use the company's 3nm N3P...