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NEWS TAGGED ACM
Friday 30 October 2026
ACM Shanghai ships first 310×310mm panel-level plating tool as order backlog surges 88%
As AI chip packages continue to grow in size, panel-level packaging equipment is gradually advancing toward customer validation and volume production.
Monday 19 October 2026
ACM Research bets on panel-level packaging and overseas growth as adoption risks persist
ACM Research is expanding beyond China as its panel-level packaging equipment advances through customer evaluations in Taiwan, while the US semiconductor equipment maker invests in...
Thursday 1 October 2026
China's chip-tool localization accelerates: ACM Research backlog jumps 88%
ACM Research (Shanghai)'s order backlog has surged alongside China's semiconductor equipment expansion, giving the Shanghai-listed chip-tool maker a larger base of future deliveries...
Monday 21 September 2026
ACM Research's Shanghai unit leans on overseas installs, panel-level plating for its next leg of growth

ACM Research Shanghai is staking its growth case on two developments: planned tool installations at customers outside mainland China...

Tuesday 16 December 2025
China's chip resilience: Naura M&A, ACM's HBM push defy US export controls
Escalating US-China tech rivalry and the politicization of the supply chain are accelerating a structural transformation in the global semiconductor equipment sector. While the US...
Friday 12 December 2025
Intel reportedly tests chip tools linked to sanctioned Chinese firms for 14A

Intel has evaluated advanced manufacturing equipment from ACM Research, a US supplier with subsidiaries subject to American trade restrictions,...

Thursday 11 September 2025
ACM Research courts TSMC as US–China dual-listed chip equipment maker bets on Taiwan expansion
ACM Research (Shanghai), Inc., dual-listed in the US and China, is maneuvering through Washington's escalating curbs on China's chip industry. Chairman David Wang emphasized that ACM,...
Tuesday 9 September 2025
China's ACM ships first KrF coater-developer to logic fab as local supply chain advances
As the global semiconductor industry undergoes rapid restructuring, Chinese equipment makers are racing to achieve breakthroughs and scale. ACM Research (Shanghai), Inc. has introduced...
Monday 8 September 2025
Ranking China's top 15 chip-equipment makers: Naura leads as R&D investment reshapes competition
China's semiconductor equipment industry posted a polarized first half of 2025, caught between a global downturn and intensifying US–China tech rivalry. A few national champions...
Wednesday 14 May 2025
China's chip toolmakers see split fortunes as AMEC, ACM Research ride localization wave
Chinese semiconductor equipment manufacturers benefited from a surge in localization-driven procurement in the first quarter of 2025. Data from CnEVPost and Chinastarmarket.cn...
Wednesday 13 November 2024
Chinese fab toolmakers invest more in R&D amidst domestic replacement wave
Leading Chinese semiconductor equipment manufacturers, including ACM Research (Shanghai), AMEC, and Naura, have boosted their R&D investments to accelerate the development of high-end...
Tuesday 15 October 2024
Self-reliance in chipmaking leads to plagiarism and intense competition, says ACM chairman
The local semiconductor equipment industry in China is presently experiencing the consequences of US export restrictions. In recent years, China's semiconductor industry has been striving...
Monday 9 September 2024
ACM secures US orders for multiple wafer-level packaging tools
ACM Research has received orders for wafer-level packaging equipment from a US-based customer and a leading US research center, according to the equipment manufacturer, which serves...
Monday 9 September 2024
Naura, ACM grab attention at SEMICON, AMEC absent
SEMICON Taiwan 2024 has officially launched with global semiconductor equipment and materials suppliers in attendance.
Wednesday 31 July 2024
ACM launches Ultra C vac-p flux cleaning tool for chiplets, breaking into FOPLP market
ACM Research has introduced its Ultra C vac-p flux cleaning equipment, specifically designed for fan-out panel-level packaging (FOPLP). This new tool employs vacuum technology to efficiently...