Supply chain insiders say that the biggest obstacles to fully electric vehicle (EV) adoption remain a lack of charging infrastructure and limited range, and following a surge in early...
On October 7, 2024, Taiwan's Ministry of Health and Welfare (MOHW) announced the establishment of three major AI centers to tackle key challenges in advancing smart healthcare: implementation,...
From stunning 4K movie visuals to smooth performance in high-refresh-rate gaming, HDMI is vital for connecting devices and enhancing the audiovisual experience. Since its introduction,...
Samsung Electronics is reportedly slowing down its investments following an aggressive wave of efforts bolstering its semiconductor foundry business, intended to accelerate the adoption...
The integration of artificial intelligence (AI) in chip design has become a focal point in the semiconductor industry. Leading electronic design automation (EDA) companies, including...
Quanta Computer, after years of pioneering AI-powered smart healthcare solutions, is now exploring wider applications across various industries. Robe Yang, senior director at Quanta's...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, is pleased to announce that its 3nm HBM3E Controller and PHY IP have been adopted by a leading Cloud Service Provider (CSP) and...
Intel reports significant global adoption of its AI PC processor, highlighting its robust software ecosystem and hardware performance, including the recent Lunar Lake processor. CyberLink...
USB4 adoption is rapidly gaining traction in the consumer electronics market, with PCs featuring AI functionality now coming equipped with multiple USB4 ports. For Taiwanese firms...
The adoption of Wi-Fi 7 across the iPhone 16 series is expected to be a key driver for the rapid penetration of the wireless technology, with Android flagship smartphones likely to...
Sitting next to a stranger on the train might lead to a great conversation, but that wasn't the experience for the main character in the film Patterns...
Despite ASML being the sole provider of high-NA EUV systems, customer adoption is affected by the high price, as ASML aims to begin mass production of the system by 2026.
As electronic products demand higher power density, driven by rising energy needs, third-generation semiconductors have become crucial. Among these, silicon carbide (SiC), known for...
Rohm Semiconductor has announced the use of power modules equipped with the company's fourth-generation SiC MOSFET bare chips for traction inverters in three ZEEKR EV models manufactured...
