Major US-based cloud service providers (CSPs) have estimated their 2024 capex will increase by at least 35% year-over-year, with research firms expecting the amounts to rise further...
MediaTek is confident in the stability and resilience of its ASIC business between 2025 and 2028 and is committed to bolstering the ecosystems of related industries, according to...
E Ink Holdings (E Ink) and Himax Technologies (Himax) have jointly unveiled the next-generation color e-paper timing controller, an ASIC T-Con named T2000.
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, anticipates a sequential increase in revenue of approximately 10% in the third quarter of 2024...
As quantum computing advances, it poses a serious threat to current encryption standards. Finnish cybersecurity startup Xiphera is working to future-proof critical infrastructure...
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, has announced its participation in the Intel Foundry Accelerator Design Services.
Nvidia CEO Jensen Huang told the global press that its plan of setting up an AI R&D center and the second AI Supercomputer Center is in progress, and directly confirmed that Nvidia...
Skymizer, a prominent Taiwan-based AI system software provider known for its compiler optimization solutions, has announced the release of EdgeThought, its new software-hardware co-design...
IC design house Egis Technology (EgisTec) has stepped up its deployment in the IP and IC design service sector, looking to capitalize on the potential of the AIoT market.
In the ever-evolving landscape of Artificial Intelligence (AI) integration, Canada-based startup Applied Brain Research (ABR) develops technology that mimics how the brain processes...
Alcor Micro, an IC design subsidiary of Egis Technology Group, is shifting its focus to the ASIC and IP industries after acquiring StarRiver Semiconductor, with efforts expected to...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that the GLink-3D interface (GUC's Link for 3D die stacking) for the TSMC 3DFabric SoIC-X 3D stacking platform...
