Siliconware Precision Industries (SPIL) projects its third-quarter revenues will grow 2-6% sequentially with both the consumer electronics and wireless communications sectors playing...
The Japan disaster in March prompted IDM and fabless companies to overbook chips, but the inventory build-up has not been consumed due to a slow second quarter, according to Bough...
Siliconware Precision Industries (SPIL) is stepping up the development of system-in-package (SiP) specifically for use in handsets, and has been more actively expanding its IDM client...
Siliconware Precision Industries (SPIL) chairman Bough Lin on April 27 confirmed that the company has been facing stretched lead times for its IC substrates due to limited availability...
Siliconware Precision Industries (SPIL) expects its sales growth to outperform the industry average in 2011, company chairman Bough Lin said at an investors meeting on January 26.
Siliconware Precision Industries (SPIL) chairman Bough Lin expects the packaging and testing sector to see a 7-13% rise in 2011, and the overall chip market to show stable growth.
IC packaging and testing house Advanced Semiconductor Engineering (ASE) saw revenues in October 2009 reach a two-year high at NT$4.9 billion (US$152 million), while rival Siliconware...
Siliconware Precision Industries (SPIL) has set its capex budget for 2010 at NT$10 billion (US$307.7 million), doubling from NT$5.3 billion allocated for 2009, according to company...
