Relentless efforts by China's new energy companies to control their sectors by undercutting the competition at home and abroad prevent innovation as non-Chinese firms cut R&D...
Murata, a Japanese electronic components manufacturer, announced the construction of a new Multilayer Ceramic Capacitor (MLCC) factory in Japan. The completion is scheduled for March...
Winbond Electronics has kicked off mass production of specialty DRAM memory using 20nm process technology, with plans to transition to a newer 16nm process, according to the Taiwan-based...
As cargo ships bound for Europe continue to take the long route around Africa to avoid potential dangers in the Red Sea, manufacturers have adjusted their strategies to account for...
OSAT providers are optimistic about business opportunities accompanying the AI boom, with many gearing up to develop new packaging technologies to support silicon photonics.
Dethroning TSMC in the wafer foundry industry seems quite impossible in the foreseeable future. However, its competitors could form partnerships, such as the recent alliance between...
The National Silicon Industry Group (NSIG), China's largest domestic silicon wafer maker, and Wafer Works (Shanghai) have been expanding production in China, according to industry...
Texas Instruments (TI) is expected to see more significant impacts from the weak demand in the industrial and automotive markets than other IDMs, according to industry sources.
TSMC, which only increases production capacity in response to significant customer orders, has recently established a production expansion strategy aimed at attaining 2nm GAA. Apple...
A significant ramp-up in CoWoS production capacity at TSMC is anticipated to propel server companies' AI server sales to new heights in 2024, according to industry sources.
ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies (YMTC), the former specializing in DRAM memory and the latter in NAND flash chips, have accelerated their development...
