India is hosting SEMICON India 2024 from September 11-13. During the event, Indian Prime Minister Narendra Modi reaffirmed India's commitment to becoming a semiconductor powerhouse...
Taiwan's trade surplus with the US reached an all-time high of US$42.26 billion in the first eight months of 2024, surpassing the US$35.6 billion total for all of 2023. This significant...
HiSilicon will hold its Connect Conference, inviting its suppliers, downstream customers, and distributors to facilitate communication and interaction with existing partners, according...
Despite encountering significant challenges from US export controls and subsequent chip shortages, China continues to make substantial progress in its AI industry. The country is...
The UK continues to further its automotive and other industries while investing heavily in high-tech sectors. Harnessing its extensive academic expertise, the country is making significant...
Despite ASML being the sole provider of high-NA EUV systems, customer adoption is affected by the high price, as ASML aims to begin mass production of the system by 2026.
Several Dutch companies showcased cutting-edge technologies at SEMICON Taiwan 2024, contributing to advancements in semiconductor manufacturing and data center infrastructure.
At Semicon Taiwan 2024, a group of Dutch companies showcased technologies quietly revolutionizing semiconductor manufacturing and related industries. These firms, many clustered around...
Chinese Outsourced Semiconductor Assembly and Test (OSAT) companies, including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics (TFME), and Tianshui Huatian...
India-based IC design house BigEndian Semiconductors raised US$3 million and aims to partner with Taiwan-based UMC to launch security chips amid the emergence of a local semiconductor...
Since carriers adopted 5G, the technology has not stopped evolving. For example, the 5G Advanced Network Solutions and the research and development of radio frequency (RF) and baseband...
In June 2024, Vanguard International Semiconductor (VIS) and NXP unveiled plans to collaborate on establishing VSMC in Singapore, where they will build a 12-inch wafer fabrication...
During a recent public discussion with Imec CEO Luc Van den Hove, MediaTek CEO Rick Tsai highlighted that there are still technical barriers to AI chip development, such as chip interconnect...
At an event in Berlin on September 4, Intel introduced the Core Ultra 200V series processors, codenamed Lunar Lake. These new processors represent Intel's most efficient x86 architecture...
As advanced Chip-on-Wafer-on-Substrate (CoWoS) technology captures the spotlight in the semiconductor industry, fan-out panel-level packaging (FOPLP), another advanced packaging technique,...
