Support from local foundries and backend houses in China is helping CMOS image sensor (CIS) firms obtain more orders, reducing the country's reliance on Sony, according to industry...
PixArt Imaging, an IC design house specializing in CMOS image sensors (CIS) and other sensor chips, expects peak season momentum to drive sales in the second half of 2024.
Anticipating a wave of smartphone replacements and growing demand for automotive applications, Taiwan-based backend houses are optimistic about the CMOS image sensor (CIS) sector...
Onsemi and OmniVision are now in a tight race for leadership in the automotive CMOS image sensor (CIS) market, with conflicting reports from research firms about which company held...
ON Semiconductor (Onsemi) has completed its acquisition of SWIR Vision Systems, a leading provider of colloidal quantum-dot-based (CQD) short wavelength infrared (SWIR) technology.
Sony inaugurated an expanded facility in central Thailand, which will make automotive CMOS image sensors (CIS), OLED display components for digital cameras, and laser diodes for high-capacity...
Japan-based Toppan Holdings has shifted the production of components for CMOS image sensor components (CIS) from Japan to China, increasing local production by 40% as Beijing seeks...
Signaling its future growth trajectory, Marvell Technology has confirmed that the company is working on data infrastructure products enabled by technology platforms on 5, 3, and 2nm...
Taiwan's efforts in advancing low-temperature CMOS and quantum computing technologies are set to receive a significant boost with the recent signing of a collaborative Memorandum...
CMOS image sensor (CIS) packaging house Tong Hsing Electronic expects modest sequential shipment growth in the fourth quarter of 2023, as communication module and car sales momentum...
Onsemi, a prominent US IDM, has unveiled its strategic shift, planning to initiate in-house production of CMOS image sensors (CIS) in 2024, marking a significant departure from its...
In a significant development for the 10-year Taiwan Chip-Driven Industrial Innovation Program (TCIIP), certain businesses have expressed their willingness to donate 12-inch wafer...
Some predictions suggest that as DRAM technology development is gradually approaching a bottleneck, hybrid bonding technology may be introduced into future DRAM manufacturing processes...
