The Mobile World Congress (MWC) will open March 2-5, 2026, in Barcelona, where industry observers expect clearer progress on satellite communications, 6G, and Wi‑Fi 8 standards...
Anthropic PBC, a leading AI developer, has released the third version of its Responsible Scaling Policy (RSP), updating its voluntary framework for mitigating catastrophic AI risks...
SK Hynix and Sandisk have launched a consortium to standardize High Bandwidth Flash (HBF), positioning the technology as a next-generation memory layer for AI inference and heightening...
Widespread speculation surrounds Nvidia CEO Jensen Huang's previously teased chips set to be revealed at the March 2026 GTC conference. Among the most discussed possibilities are the...
Taiwan's offshore wind sector is entering the third phase of block development (Phase 3-3) vendor selection, marking the first time localization requirements have been removed. The...
Tesla CEO Elon Musk has amplified recruitment of South Korean semiconductor talent via social media, deepening competition for engineers as global tech firms increasingly target the...
Since launching in 2020, SpaceX's Starlink satellite internet service has grown into the company's largest revenue driver, surpassing its rocket launch business and becoming central...
Around the 2026 Lunar New Year, China's large model market entered its most concentrated launch cycle to date. Z.ai, MiniMax, Alibaba, and ByteDance released or upgraded models across...
Alphabet's Waymo has refocused competition from pure perception advances to real-world feasibility and business model viability with its sixth-generation autonomous driving hardware...
Advanced Micro Devices (AMD) is making a bold pivot by guaranteeing a US$300 million loan for cloud startup Crusoe, signaling a shift from pure hardware competition to financial engineering...
Nvidia CEO Jensen Huang's absence from India's AI Impact Summit and his appearance at a late-night engineer gathering in California have drawn attention to the chipmaker's strategic...
The ongoing global shortage of glass fiber, a critical upstream material for PCBs, has escalated competition among major end customers and is driving a structural reallocation of capacity...
Alibaba Group on February 16 launched Qwen 3.5, positioning the new model as a flagship upgrade designed for the "agentic AI era," as competition in advanced artificial intelligence...
Samsung Electronics is reportedly accelerating preparations for next-generation high-bandwidth memory (HBM), moving to establish a hybrid bonding production line at its Cheonan campus...
