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NEWS TAGGED COOLING
Wednesday 9 October 2019
Furukawa, Lemtech team up for smartphone thermal solutions
Japan's Furukawa Electric and Taiwan-based Lemtech have teamed up to develop stainless steel-based ultra-thin vapor chamber cooling solutions for smartphones.
Tuesday 24 September 2019
Anli to see efforts pay off in non-notebook cooling segments in 4Q19
Taiwan-based notebook thermal solutions provider Anli International expects its deployments in non-notebook segments to bear fruit starting in the fourth quarter of 2019, when the...
Monday 2 September 2019
Taiwan component makers seek opportunities from 5G and foldable devices
Taiwan-based component makers, despite seeing shrinking demand for notebooks, have found new opportunities from emerging businesses such as foldable smartphones, foldable-screen notebooks...
Thursday 29 August 2019
Cooling solutions providers to expand capacities on 5G smartphone demand
Cooling module makers including Auras Technology, Chaun-Choung Technology (CCI) and Taisol Electronics are all moving to expand their capacities for vapor chambers (VCs) to cash in...
Wednesday 28 August 2019
Cooling modules maker CCI sees shipments surge for smartphones in 2H19
Taiwan-based cooling modules supplier Chaun-Choung Technology (CCI) has seen shipments for smartphones ramp up since the third quarter of 2019, expecting the revenue ratio for such...
Thursday 8 August 2019
Vapor chamber demand to grow exponentially for 5G smartphones, says Auras chair
Demand for vapor chambers (VCs) from smartphone vendors will grow exponentially in the next few years to support high heat-sinking performance required for 5G smartphones, according...
Thursday 8 August 2019
Samsung pioneers adoption of 0.35mm vapor chamber in new Galaxy series
Samsung Electronics has taken the lead to adopt 0.35mm vapor chambers (VC) in its newly released Galaxy Note 10 series, which may become mainstream smartphone heat-sinking spec in...
Monday 15 July 2019
Taiwan cooling solution providers poised for robust growth
Taiwan's cooling module suppliers are set for robust growth in 2020 and beyond driven by demand for heatpipe- or vapor chamber (VC)-based heat dissipation solutions from the smartphone...
Thursday 11 July 2019
Vapor chamber to account for 50% of smartphone cooling module shipments in 2H19
With rising heat dissipation demand from major vendors including Samsung Electronics, LG Electronics, Huawei, Oppo and Xiaomi for their 5G smartphones, half of cooling module shipments...
Thursday 27 June 2019
Rising public cloud demand triggering business model changes
With the public cloud continuing expanding its presence in the cloud computing market, a few players including HPE and Chaun-Choung Technology (CCI) have been pushing new products...
Tuesday 25 June 2019
Chaun-Choung poised to enter EV heatsink segment
Taiwan-based cooling module maker Chaun-Choung Technology (CCI) is poised to tap into the segment of heatsink solutions for electric vehicles and self-driving cars through Japan's...
Wednesday 12 June 2019
Notebook component makers taking actions to cushion US-China trade war impact
Taiwan-based notebook component makers at the moment have come up with two different approaches to shipping their products to ODMs, as they closely monitor the development of the...
Monday 10 June 2019
Cooling module makers see rising business in 5G segment
As China's Ministry of Industry and Information Technology is set to issue 5G licenses in the near future, sources from cooling module makers have pointed out that they have received...
Friday 31 May 2019
Colorful announces iGame Z390 Vulcan X
Colorful has recently announced the new 2019 addition to its gaming motherboard product family, iGame Z390 Vulcan X, powered by the Intel Z390 chipset. The flagship motherboard features...
Thursday 30 May 2019
Thermaltake steps into gaming memory sector
PC peripheral specialist Thermaltake has unveiled its gaming memory product line, expanding its offerings that currently include chassis, power supply and cooling module products.
TPCA
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research