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NEWS TAGGED COOLING
Thursday 6 November 2014
Intel Core M platform to account for below 10% of notebook shipments in 2015, say sources
Intel's new low-power-consumption Core M-series platform, featuring a fanless design, is expected to account for only 5-10% of most notebook vendors' shipments in 2015, and cooling...
Monday 6 October 2014
Vapor chamber looks promising for smartphone cooling
In addition to ultra-thin heat pipes, cooling module makers have also developed vapor chamber solutions for mobile devices and several Japan-, Taiwan- and Korea-based smartphone vendors...
Thursday 14 August 2014
Cooling module maker Yen Sun enters supply chains of Europe car vendors
Cooling module maker Yen Sun Technology has entered the supply chains of Europe-based car vendors Volkswagen, Daimler AG and BMW, and has already started supplying products, helping...
Thursday 14 August 2014
Wafer foundry houses seeking better cooling solutions
Wafer foundry houses reportedly have been seeking cooperation with cooling module makers looking to apply cooling solutions into chips during the manufacturing process. So far the...
Friday 25 July 2014
Notebook cooling module makers eye business opportunities from electric vehicles
Notebook cooling module makers including Taiwan-based Chaun-Choung Technology and Japan-based Furukawa Electric, in view of the large potential demand for heat dissipation solutions...
Monday 16 June 2014
Notebook cooling fan makers enter module assembly industry
Taiwan-based notebook cooling fan makers such as Delta Electronics and Sunonwealth Electric Machine have recently expanded into the cooling module assembly business with some even...
Friday 23 May 2014
Taiwan cooling module makers to be surpassed by China makers in 2 years
While Taiwan-based cooling module makers have been developing 0.6-0.8mm ultra-thin heat-pipes for smartphones, China-based makers have brought continued competitive pressure through...
Monday 21 April 2014
Cooling module makers to further reduce mobile device heat pipe thickness; expect penetration rate of over 15%
Cooling module makers such as Japan-based Furukawa Electric Group and Fujikura and Taiwan-based Chaun-Choung Technology and Taisol Electronics, are looking to reduce the thickness...
Monday 17 March 2014
Smartphone cooling module demand may remain weak until 2015
Despite having received orders for tablet heat pipes, Taiwan-based cooling module makers are still not able to land orders from most smartphone vendors and are unlikely to do so until...
Monday 3 March 2014
China suppliers to compete for notebook cooling module orders in 2014
The China supply chain has reportedly entered the notebook cooling module industry recently and is set to expand their supply to notebook brand vendors in 2014, according to sources...
Monday 25 November 2013
Cooling module makers retreat from PC industry
Seeing the PC industry suffering from stagnant demand, cooling module makers are aggressively lowering the contribution of their PC-related businesses and turning to focus on the...
Tuesday 2 July 2013
Cooling module makers turning to server industry
Weak demand in the notebook market is prompting cooling module makers to turn to the server sector, which is enjoying strong demand because of the rise of cloud computing, according...
Monday 17 June 2013
First-tier players may release smartphones that adopt heat pipes by the end of the year
Smartphone players such as Apple, Samsung Electronics and High Tech Computer (HTC) have started showing interest in adopting ultra-thin heat pipes for their smartphones and are expected...
Monday 21 January 2013
Cooling module makers to benefit from smartphone and tablet orders in 2013
Cooling module makers, which used to mainly focus on supplying notebook products, are expected to benefit from orders from smartphone and tablet products in the second quarter of...
Monday 22 October 2012
Auras to push non-notebook business
Taiwan-based cooling module maker Auras has been adjusting its notebook and non-notebook business proportions to avoid from putting all the focus in only a single segment and currently,...
megawin
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research