Gallium nitride (GaN) is emerging as a key power semiconductor for AI data centers, where rising rack power and the shift toward higher-voltage...
AI infrastructure customers are starting to reconsider how much high-bandwidth memory (HBM) needs to be placed alongside accelerators...
MediaTek officially unveiled the Dimensity 9600 Pro on September 15, 2026, drawing significant industry attention to its choice of packaging...
South Korea's neural processing unit (NPU) startups are moving from chip development toward commercial deployment, but limited experience...
SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with...
China's humanoid robot industry is moving from prototypes to industrial production. The next test is no longer whether robots can be...
Samsung Electronics and SK Hynix are preparing to move DRAM below the 10nm threshold in 2028, with the two memory makers pursuing different...
After months of tight supply and sharp price increases in 2026, the global memory market is expected to see its supply-demand gap narrow...
