A demand downturn has made SK Hynix reduce the production of CMOS image sensors (CIS) and prioritize High Bandwidth Memory (HBM) business in the short term.
Taiwan Semiconductor Manufacturing Company (TSMC) expects its revenue in US dollars to increase 21-25% this year, exceeding the foundry market average of 20%.
Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.
Steel is a critical raw material for the wind industry. While steel makes up a quarter of the materials needed for onshore wind per MW, it jumps to a staggering 90% for offshore installations,...
According to sources at IC packaging material distributors, advanced packaging and heterogeneous integration are driving demand for high-end materials.
The global ascent of 5G applications remains in full swing. David Chou, General Manager of Ericsson Taiwan, notes that Fixed Wireless Access (FWA), mobile Internet of Things (IoT),...
At Taipower's year-end press conference on January 16, Tseng Wen-Sheng, Deputy Minister of Economic Affairs and Acting Chairman of Taiwan Power Company (Taipower), projected an industrial...
According to Nikkei, Japan-based semiconductor equipment provider Disco is anticipated to invest over JPY40 billion (US$273.8 million) to build a plant in Kure, Hiroshima...
OLED display driver IC (DDI) demand for mobile phones is expected to continue rising in 2024, thanks to the increasing adoption of OLED panels by Chinese mobile phone brands and the...
