After approving four IC backend manufacturing facilities earlier this year, India reportedly plans to provide more incentives for compound semiconductor and silicon photonics proje...
Amid the growing demand for AI and its applications, electronic component distributors have adopted varied strategies. American companies are focusing on building AI ecosystems, while...
General Motors (GM) recently announced the elimination of over 1,000 jobs, with its software and services division bearing the brunt of the cuts. This move underscores the immense...
With the increasing implementation and demand for edge AI applications, DRAM manufacturer Innodisk stated that its edge AI projects have been progressing smoothly with AIoT-related...
Fifteen Japanese companies plan to invest approximately JPY100 billion (US$680 million) in research, development, and equipment across Southeast Asia, focusing on the electric vehicle,...
Global manufacturing has been significantly influenced by geopolitical tensions in recent years, prompting the sector to revisit regionalization and local production plans. This shift...
Printed circuit board (PCB) and IC substrate equipment specialist Group Up Industrial (GP) has stepped up the development of its glass substrate offering, eyeing robust demand for...
Taiwan's Shinkong Synthetic Fibers Corporation (SSFC) has made significant inroads into China's electric vehicle market with materials such as elastomers and automotive films. Despite...
Nvidia's revised launch schedule for its next-gen Blackwell AI chips has led to changes in the supply chain, with some server makers shifting their focus to developing GB200-based...
Latest rumors have it that Apple is ready to equip the iPhone with its in-house developed modem chip in 2025, but industry sources remain skeptical. Even if Apple was able to roll...
With Intel and Wolfspeed delaying the development of facilities in Germany, TSMC will break ground on a new plant in Dresden on August 20, which is critical for Germany, according...
Texas Instruments (TI) and the US Department of Commerce have signed a non-binding preliminary memorandum of terms for up to US$1.6 billion in proposed direct funding under the CHIPS...
Daxin Materials, which provides specialty chemicals for semiconductor, display, and key raw materials, has developed chipmaking materials supporting advanced 2nm manufacturing processes...