Amidst endeavors to cultivate a semiconductor ecosystem, India is purportedly contemplating creating an IP pool for semiconductor startups, mirroring the approach adopted by Taiwan...
To sustain its chip design capabilities, Taiwan must advance its development of Electronic Design Automation (EDA) tools for 3D Heterogeneous Integration (3DHI) and explore next-generation...
Google announced the launch of the sixth generation TPU called Trillium, boasting 4.7 times the computing power of TPU v5e and a doubling of High Bandwidth Memory (HBM) performance,...
Vincent Yang, CEO and founder of ProLogium, stated that the factory in Zhongli, Taoyuan has entered the customer verification stage, with plans to produce 200 Lithium-Ceramic Batteries...
Huawei has recently launched its Pura 70 series smartphones featuring its in-house developed Kirin 9010 application processors made using SMIC's 7nm N+2 manufacturing process.
Japan's semiconductor foundry startup Rapidus, now on a mission to mass produce 2nm chips by 2027, is developing advanced packaging and chiplet technologies, with a particular focus...
Samsung Electronics recently decided to form a 100-person team to invest in the research and production of 10nm seventh-generation 1d DRAM. Facing rapid catch-up from competitors...
Samsung Electronics reportedly plans to dedicate separate development teams for next-generation High Bandwidth Memory (HBM) products, HBM3E and HBM4, to strengthen its competitiveness...
Samsung Electronics and SK Hynix are locked in fierce competition in the High-Bandwidth Memory (HBM) market, with attention turning to Nvidia, the leader in Artificial Intelligence...
Peter Chen, Chairperson of Qisda, stated that the company has passed the lowest ebb of operation in 2024, with growth expected to occur quarter by quarter.
Penang state boasts Malaysia's most comprehensive semiconductor ecosystem, and the state government remains committed to collaborating with the federal government to attract investments...
According to sources cited by the Wall Street Journal (WSJ), Apple is said to be working on a chip designed specifically for running artificial intelligence software on data...
Besides being a key supplier for Apple's IT products, leading backlight module manufacturer Radiant Opto-electronics has been actively expanding into the telematics market in recent...
SK Hynix recently held a press conference to unveil its development blueprint for HBM4, scheduled for mass production in 2025, a year ahead of the original plan, to maintain its technological...
Acoustoelectric component maker Primax Electronics expects multi-sensory integration products focused on vision, hearing, and touch, as well as public safety equipment, AIoT visual...
