Printed circuit board (PCB) and IC substrate equipment specialist Group Up Industrial (GP) has stepped up the development of its glass substrate offering, eyeing robust demand for...
Taiwan's Shinkong Synthetic Fibers Corporation (SSFC) has made significant inroads into China's electric vehicle market with materials such as elastomers and automotive films. Despite...
Nvidia's revised launch schedule for its next-gen Blackwell AI chips has led to changes in the supply chain, with some server makers shifting their focus to developing GB200-based...
Latest rumors have it that Apple is ready to equip the iPhone with its in-house developed modem chip in 2025, but industry sources remain skeptical. Even if Apple was able to roll...
With Intel and Wolfspeed delaying the development of facilities in Germany, TSMC will break ground on a new plant in Dresden on August 20, which is critical for Germany, according...
Texas Instruments (TI) and the US Department of Commerce have signed a non-binding preliminary memorandum of terms for up to US$1.6 billion in proposed direct funding under the CHIPS...
After navigating through inventory challenges, E Ink Holdings (E Ink) has seen positive growth in the field of consumer electronics (CE) and Internet of Things (IoT), with expected...