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Friday 20 September 2024
China's homegrown DUV equipment struggles with multiple exposures, hindering chip process advancements
China's latest domestically produced DUV exposure machine cannot perform the critical multiple exposures needed for advanced chip production, making it incapable of achieving finer...
Friday 20 September 2024
India's Suchi Semicon to begin OSAT operations with legacy packaging
Ever since India embarked on its journey into semiconductor manufacturing, Outsourced Semiconductor Assembly and Test (OSAT) and Assembly, Testing, Marking, and Packaging (ATMP) plants...
Friday 20 September 2024
TSMC demand boosts suppliers performance; smaller ones gain competitiveness
Benefiting from TSMC's performance in advanced processes and advanced packaging, related suppliers are also seeing their fortunes rise, further strengthening Taiwan's semiconductor...
Thursday 19 September 2024
China's self-developed immersive DUV system remains years away despite milestone in dry DUV technology
China recently achieved a milestone with its indigenous lithography system, which is capable of producing chips at nodes smaller than 65nm. However, the development of an immersive...
Thursday 19 September 2024
Japanese semiconductor suppliers expand in India amid Chinese import substitution
At SEMICON India 2024, major Japanese semiconductor suppliers participated, with Tokyo Electron set to expand its presence in India, underscoring the strategy to tap into the growing...
Thursday 19 September 2024
Glass substrate technology gains traction for advanced packaging by 2026
As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal...
Wednesday 18 September 2024
iPhone 16 series to drive Wi-Fi 7 adoption, benefiting chip makers in 2025
The adoption of Wi-Fi 7 across the iPhone 16 series is expected to be a key driver for the rapid penetration of the wireless technology, with Android flagship smartphones likely to...
Wednesday 18 September 2024
Applied Materials aims to grow chip clusters in India with partners
India's approval of one wafer fab and four integrated circuit (IC) backend projects has prompted semiconductor equipment providers from the US and Japan to expand their operations...
Wednesday 18 September 2024
How far is China from 28nm process after domestic lithography breakthrough?
One of the critical focal points in the US-China tech war is the collaborative effort by the US, Japan, and the Netherlands to prevent Chinese semiconductor companies from acquiring...
Monday 16 September 2024
iPhone 16 reduces investment pressure on LG Innotek with folded zoom
LG Innotek's equipment investments have significantly decreased in 2024, following two years of substantial investments to meet Apple's needs. The company has now achieved sufficient...
Monday 16 September 2024
Samsung reportedly exploring dry photoresist technology for 1c DRAM
Samsung Electronics is reportedly exploring using dry photoresist for its upcoming 6G 10nm-class DRAM (1c DRAM) to widen its lead in DRAM with its competitors, such as SK Hynix and...
Monday 16 September 2024
Samsung Display gears up for Apple foldables with 2024 supply chain rollout
Samsung Display (SDC) is reportedly accelerating the development of foldable devices for Apple as the South Korean giant is coordinating preparations with its partners, aiming to...
Monday 16 September 2024
Debunking China's first indigenous DUV lithography system
The recent unveiling of a new local deep ultraviolet (DUV) lithography machine model by China's Ministry of Industry and Information Technology (MIIT) has become a hot topic of discussion...
Monday 16 September 2024
Leading EUV mask inspection provider aims for double-digit revenue growth amid generative AI hype
Lasertec, the sole provider of EUV patterned mask inspection systems, aims for double-digit revenue growth despite a slowdown in sales from China due to US export restrictions. The...
Monday 16 September 2024
Mirle breaks new ground in robotics as OHT hits a wall in advanced packaging
Mirle has made notable strides in the semiconductor automation equipment sector in recent years, with related businesses now accounting for nearly half of the company's total revenue...
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research