Fifteen Japanese companies plan to invest approximately JPY100 billion (US$680 million) in research, development, and equipment across Southeast Asia, focusing on the electric vehicle,...
Printed circuit board (PCB) and IC substrate equipment specialist Group Up Industrial (GP) has stepped up the development of its glass substrate offering, eyeing robust demand for...
TSMC has received an influx of orders for CoWoS and other chipmaking equipment, the majority of which require super hot runs (SHR), according to industry sources.
Backed by strong support from the Chinese government and the inconsistent actions of the US, Chinese semiconductor equipment manufacturer Advanced Micro-Fabrication Equipment (AMEC)...
With Intel and Wolfspeed delaying the development of facilities in Germany, TSMC will break ground on a new plant in Dresden on August 20, which is critical for Germany, according...
Taiwanese equipment manufacturer C Sun, originally focused on the panel and PCB industries, has strategically pivoted toward the semiconductor sector. About fourteen years ago, C...
Japan-based semiconductor equipment supplier Disco plans to establish its presence in India, as India plans to build a chipmaking ecosystem amid the global diversification in semic...
On August 15, Applied Materials held an earnings call, noting that Intel's planned reduction in capital expenditures is expected to have minimal impact on the company. Applied Materials...
TSMC has acquired Innolux's 5.5G LCD fab in Tainan, southern Taiwan, for NT$17.14 billion (US$530.8 million). The acquisition price is less than what the market had anticipated.
SK Hynix has reportedly begun procuring production equipment for its M16 plant in Icheon, aiming to boost its monthly production capacity from 100,000 to 180,000 units, an increase...
Taiwan-based chip inspection supplier Utechzone has reported substantial growth in earnings, thanks to its successful expansion into the advanced packaging equipment market. The company's...