The Federal Ministry for Economic Affairs and Climate Action of Germany (BMWK) has officially approved financing for TSMC's wafer fab project in Dresden. The German government has...
ESMC has commenced construction on a new semiconductor fabrication facility in Dresden, Germany. The joint venture between TSMC, Robert Bosch, Infineon, and NXP is investing over...
Many chipmakers have disclosed delays or suspensions in their new European fab projects; however, TSMC's are proceeding more efficiently than those of their competitors.
European Semiconductor Manufacturing Company (ESMC), a joint venture between TSMC, Robert Bosch, Infineon Technologies and NXP Semiconductors, has held a groundbreaking ceremony to...
Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...
TSMC Chairman C.C. Wei is set to lead the groundbreaking ceremony for the European Semiconductor Manufacturing Company (ESMC) in Dresden, Germany, on August 20, 2024.
Having to overcome ramps and bumps on its internationalization journey, Taiwan Semiconductor Manufacturing Company (TSMC), the world's leading pure-play foundry, is learning to act...
Former Bosch Semiconductor plant manager Christian Koitzsch confirmed that he is now president of TSMC's European subsidiary, European Semiconductor Manufacturing Company (ESMC)
