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NEWS TAGGED FAB
Thursday 31 October 2024
UMC sees falling fab utilization and gross margin in 4Q24
Pure-play foundry United Microelectronics (UMC) anticipates a decline in both its fab utilization rate and gross margin in the fourth quarter of 2024, and has lowered its capital...
Wednesday 30 October 2024
Infineon unveils ultra-thin 20-micrometer power semiconductor wafer
Infineon Technologies has disclosed its latest milestone in semiconductor manufacturing technology, following the announcement of the world's first 300-millimeter GaN power wafer...
Wednesday 30 October 2024
TSMC faces the localization test amid globalization's waning influence
On October 26th, the TSMC "family" gathered for its annual sports day, with founder Morris Chang calling it his favorite day of the year. Hosting for the first time, Chairman C.C...
Tuesday 29 October 2024
Intel's US fab ambitions clash with election-year politics
In July 2022, Congress passed the CHIPS and Science Act, the largest-ever federal funding package for semiconductor manufacturing—a milestone Intel CEO Pat Gelsinger has devoted...
Tuesday 29 October 2024
TSMC intends to expand AP8 by acquiring nearby facilities from Innolux, say sources
TSMC, which acquired Innolux's 5.5G LCD fab in Tainan (southern Taiwan) in August, intends to acquire additional Innolux facilities that are adjacent to the one it has already acquired,...
Monday 28 October 2024
Can Intel and Samsung unite to challenge TSMC's foundry throne?
South Korea's Maeil Business Newspaper recently reported that Intel CEO Pat Gelsinger is seeking a face-to-face meeting with Samsung Electronics Chairman Jae-yong Lee to...
Monday 28 October 2024
China remains a key player in mature processes, set to invest over US$100 billion in capacity expansion over the next three years
Amid the surge of investments in the semiconductor sector, China's focus on mature process technologies is essential. In a recent interview in Shanghai, SEMI China President Lung...
Monday 28 October 2024
Rapidus's Hokkaido 2nm fab nears completion, eyes 1.4nm production with government support
Rapidus has announced that its first wafer fab in Hokkaido, which is intended for 2mm chip production, is now 80% complete. The company also aims to progress to 1.4mm chips if its...
Monday 28 October 2024
TSMC Arizona chip yields surpass Taiwan's, a win for US push
Taiwan Semiconductor Manufacturing Co. has achieved early production yields at its first plant in Arizona that surpass similar factories back home, a significant breakthrough for...
Thursday 24 October 2024
Japan restarts minimal fabs to train semiconductor talent
Talent development is a key challenge for Japan as it seeks to revitalize its semiconductor industry. In response, the Japanese government has chosen to resurrect the half-inch wafer...
Wednesday 23 October 2024
PSMC chairman turns caution towards India to optimism amid Tata partnership
After a partnership between Taiwan-based Powerchip Semiconductor Manufacturing Corporation (PSMC) and Japan-based SBI Holdings to establish a wafer fab fell through, PSMC is now pursuing...
Tuesday 22 October 2024
Inside PSMC's failed deal with SBI: Chairman Frank Huang reveals strategic risks and Japan's tough policies
Powerchip Semiconductor Manufacturing Corp. (PSMC) chairman Frank Huang responded on October 21 to accusations from SBI Holdings chairman Yoshitaka Kitao that the Powerchip Group...
Tuesday 22 October 2024
JASM's first fab to run on 100% renewable energy upon launch; second fab construction to begin by end of 2024
In mid-October, Yuichi Horita, president of JASM, TSMC's subsidiary in Japan, announced that the fab will operate on 100% renewable energy upon its launch, setting a precedent ahead...
Thursday 17 October 2024
Adani reportedly talking with more Israel firms in semiconductor foray
After a partnership with Israel-based Tower Semiconductor for a wafer fab in India, the Adani Group is reportedly talking with two large Israel-based nich technology firms to form...
Wednesday 16 October 2024
TSMC raises CoWoS output goal again, say sources
TSMC has been urging its factory engineering and equipment suppliers to expedite shipment pull-ins, enabling the contract chipmaker to raise its monthly output target for CoWoS packaging,...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research