Display driver IC (DDI) backend specialist Chipbond Technology has shifted its attention to non-DDI chips and devices such as RF components and power amplifiers, which will account...

Taiwan-based Chipbond Technology, now holding the world's largest backend capacity for panel display driver ICs (DDI), continues to deepen cooperation with local OSAT Orient Semiconductor...

Chipbond Technology, a backend house specializing in LCD driver ICs, is expected to see its third-quarter revenues climb to an all-time high, according to market watchers.

Chipbond Technology, a backend house specializing in LCD driver ICs, is expected to see its third-quarter revenues peak for 2017 driven by a pull-in of orders from Japan-based clients,...

A demand rebound for large-size LCD panels will take place in the first two weeks of October instead of August as previously expected, Fei-Jain Wu, chairman of driver-IC packaging...

Chipbond Technology has set a capex goal of NT$1.5 billion (US$47 million) for 2010 compared to NT$700 million allocated for the previous year, according to company chairman Fei-Jain...

Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and...

Not seeing an anticipated warm-up in LCD driver IC demand from May, Chipbond has revised down its sales guidance to a sequential decline of 1-5% in the second quarter, in contrast...