The US Department of Commerce and SK Hynix have signed a non-binding preliminary memorandum of terms to provide up to US$450 million in proposed federal incentives under the CHIPS...
Applied Materials Inc. was informed by US officials that it won't be receiving Chips Act money for a long-anticipated research and development center, dealing a critical blow to a...
Samsung Electronics is ramping up investment efforts in AI chip startups to strengthen its competitiveness in new-generation AI semiconductor technologies.
Amkor Technology has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act, according...
On July 17, the Biden-Harris Administration announced a non-binding Preliminary Memorandum of Terms (PMT) between the US Department of Commerce and GlobalWafers America, LLC and MEMC...
The Goddard Space Flight Center of the National Aeronautics and Space Administration (NASA) has introduced Augmented Reality (AR) technology into the spacecraft assembly process for...
iVP Semi, an India-based IC design house, has recently been established and has secured US$5 million in pre-Series A funding. The startup plans to leverage this investment to establish...
According to Bloomberg, Electronic Product and Technology, and Proactive Investors, the Canadian government has announced a CAD120 million (US$88.2 million)...
The Biden administration is kicking off a program to cultivate the US computer-chip workforce, aiming to stave off a labor shortage that threatens to undermine domestic semiconductor...
Entegris and the US Department of Commerce have signed a non-binding preliminary memorandum of terms (PMT) for up to US$75 million in proposed direct support under the CHIPS and Science...
Netherlands-based Axelera AI, an AI acceleration hardware and software provider has announced the successful completion of their US$68 million Series B financing round.
